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High-Speed Board-to-Board
High-Density Arrays
SEARAY™
SEAF
High-Speed Board-to-Board
High-Density Arrays
SEARAY™
SEAF

SEAF

Product Specs
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SEAF

Product Specs

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

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SEARAY™ is an open-pin-field array .050" (1.27 mm) pitch connector. Available with up to 500 pins, SEARAY™ maximizes design and routing flexibility for single-ended or differential pair configurations, and for power, signal, or ground. SEARAY™ uses the Edge Rate® contact system which is designed for applications requiring high-mating cycles and 56 Gbps PAM4 performance.

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Features

  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products

  • Analog Over Array™ capable

  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products

  • Up to 500 I/Os

  • Rugged Edge Rate® contact

  • 56 Gbps PAM4 performance

  • SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing

  • .050" (1.27 mm) pitch

  • Stack heights from 7 mm to 18.5 mm

  • Lower insertion/withdrawal forces

  • Solder charge termination

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