Samtec COM-HPC® Interconnects

The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers, and provides scalability for next-gen embedded system designs. Samtec interconnects included in this standard offer 5 mm and 10 mm stack heights, a 400 pin open-pin-field on 0.635 mm pitch, BGA attach, and up to 112 Gbps PAM4 performance. Please watch the video to learn more. https://www.samtec.com/standards/picmg/comhpc