Samtec | High Speed Board-to-Board

Service Center Login

HIGH SPEED BOARD-TO-BOARD

EDGE CARD / MICRO BACKPLANE

MICRO PITCH BOARD-TO-BOARD

STANDARD BOARD-TO-BOARD

RUGGED / POWER

HIGH SPEED CABLE ASSEMBLIES

ACTIVE OPTICS

RF CABLE AND COMPONENTS

IDC / DISCRETE WIRE

PANEL & I/O

STANDARDS / PLATFORMS

CUSTOM PRODUCTS

PRODUCT INFORMATION

QUALITY / PROCESSING / TOOLS

SIGNAL INTEGRITY SERVICES

RUGGED / POWER INTEGRITY

SUDDEN SERVICE

SERVICE CENTER

TECHNICAL LIBRARY

High Speed Board-to-Board

HIGH DENSITY ARRAYS
SEARAY™
Specifications Pitch: .050” (1,27mm) & .8mm (.0315") Stack Height: 7-17,5mm Contacts: Up to 500 I/Os Performance: Up to 18 GHz / 36 Gbps	Series SEAF – .050" Socket SEAM – .050" Terminal SEAF-RA – .050" Right Angle Socket SEAM-RA - .050" Right Angle Terminal SEAM8 - .8mm Terminal SEAF8 - .8mm Socket SEAMP - .050" Press Fit Terminal
Features Maximum routing and grounding flexibility Lower insertion/extraction forces vs typical array products Numerous row options: Slim 4 row – 10 row “Zippered” mating/unmating Unique solder charge technology Fixturing required to process right angle eight and ten row options	Additional Links Performance Data - Single-Ended Performance Data - Differential Pair Final Inch® eBrochure PCI Express Pismo2 Vita57 Maximum Pair Count Data Processing Recommendations Media Room Contact us
LP Array
Specifications Pitch: .050” (1,27mm) Stack Height: 4 - 5mm Contacts: Up to 180 I/Os	Series LPAM – .050" Terminal LPAF – .050" Socket
Features Low Profile Open pin field design Unique solder charge technology	Additional Links Contact us
HD Mezz* Open Pin Field Array
Specifications Pitch: 1,20mm (.0472”) Stack Height: 20-35mm Contacts: 299, 195, or 143 I/Os Performance: Up to 9.5 GHz / 19 Gbps	Series HDAF – 1,20mm Socket HDAM – 1,20mm Terminal
Features Open pin field design Better performance at taller stack heights Intermateable with Molex Inc HD Mezz* *HD Mezz is a Molex product that is intermatable with Samtec’s HD Mezz system. HD Mezz is a trademark of Molex Incorporated.	Additional Links Performance Data - Single-Ended Performance Data - Differential Pair Final Inch® eBrochure Contact us
DP Array™ (Differential Pair Array)
Specifications Pitch: 2,16mm (.0850”) Stack Height: 10mm, 14mm, 17mm Contacts: Up to 100 I/Os Performance: Up to 7.0 GHz / 14 Gbps Series	Series DPAF – 2,16mm Socket DPAM – 2,16mm Terminal
Features Staggered pin layout reduces grounds Up to 168 usable pairs No return paths needed Perimeter grounds simplify routing Unique solder crimp on tails	Additional Links Performance Data - Differential Pair Final Inch® eBrochure PCI Express Contact us
Z Beam® One Piece Interface
Specifications Pitch: .050” (1,27mm) Contacts: Up to 900 I/Os Stack Height: 1,65mm & 3mm Series	Series GFZ – .050” (1,27mm) One Piece Interface
Features Solderless connection with compression tail Low Profile Easy to replace: Allows field upgrade/exchange Minimizes coefficient and thermal expansion issues	Additional Links Contact us

Related Links
High Speed Board-to-Board Information Signal Integrity Product Overview Samtec Final Inch® Signal Integrity Information Charts Signal Integrity Literature Technical Information Interactive Connector Selector Test Data Comparison Industry Standards and Platforms Rugged Designs Build a Part Number Signal Integrity FAQs Signal Integrity E-mail Tips Signal Integrity Services Form Contact Our SI Group

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.