HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
ACTIVE OPTICS
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Standards / Platforms

Altera®

Altera® HSMC Mezzanine Card
Specifications, ordering instructions, and additional product information on Samtec’s High Speed Mezzanine Card developed specifically for Altera® are available here.
Altera Development Kits
Arria® II GX FPGA Development Kit
Stratix® IV GX FPGA Development Kit
Audio Video Development Kit, Stratix® IV GX Edition  
Cyclone® III FPGA Development Kit
DSP Development Kit, Cyclone® III Edition  
Altera Embedded Systems Development Kit, Cyclone® III Edition
DSP Development Kit, Stratix® III Edition
The Stratix III FPGA Development Kit

Terasic DE3 System, Stratix III Edition

For a complete listing of Altera daughter cards to expand the functionality of other development platforms, including those which utilize the HSMC Specification, go to: www.altera.com/products/devkits/kit-daughter_boards.jsp

Samtec Final Inch® PCB Design Tools
Break Out Region (BOR) PCB designs that save design, development and validation time and resources and predict real-world performance expectations in real world signal integrity applications.

Samtec High Speed Cable Solutions
Samtec offers a few standard lengths of High Data Rate cables for customer hardware applications, which use the HSMC connectors and need a high speed cable. Contact the TLS Group for technical information and the Pricing Group to request a quotation.

Samtec also offers a high speed coax SMA breakout cable for observation of the differential signal channels on a test instrument. Contact the TLS Group for technical information and the Pricing Group to request a quotation.

NOTE: The HDR-128291-XX breakout assembly is suitable to test the signal pins of each bank individually.  This is assuming the customer has the socket ASP-122953-01(a modified QSH series) on their board since the cable assembly has the terminal ASP-122952-01 (a modified QTH series).  

Also, note that in Bank 1 of ASP-122953-01, every third pin is omitted for pair separation and is an exact match to the pinout of the connector on the HDR-128291-XX assembly.   Banks 2 & 3 on ASP-122953-01 are laid out with the signals on the matching pins to mate to the HDR-128291-XX cable, however every third power pin would be a "No Connect" when the cable is mated.

General Information
For more information contact Altera® at http://www.altera.com

or more information on Samtec's variety of test products available:
Flip through our Altera - Silicon Test, Development and OEM Hardware eGuide or click here
to download a PDF version
or contact Samtec’s Reference Design Group.

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