Samtec's solder charge technology featured on the high-density  SEARAY™ system provides superior retention forces and reliability.  This short animation compares the solder-charge stamping process to traditional BGA soldering processes.  In typical BGA solder joints, the widest area of the solder is just above the point of contact on the solder pad.  With solder charge technology, the solder melts through a hole on the contact tail, and creates a 360 degree engulfment of the PCB tail stub. This creates a solder joint that takes complete advantage of the solder pad area on the PCB.