Power Integrity Certified products meet the following criteria:

• Current Cycling Test EIA 365-55 indigitive of the reliability of the contact interface and the ability of the connector system to be stable over extended use.
• Current Carrying Capacity, Resistance and Amps vs. Number of Contacts data must also be available.  
• Power Integrity Guidelines are available.

These products are Power Integrity Certified:

• Power Strip Board-to-Board system
  (PES/PET Series)
• .200" (5,08mm) pitch (HPM/HPF) Series Header and Socket system
• Mini PowerStrip Board-to-Board system (MPT/MPS Series)
• Power Mate™ Board-to-Board
  (IPBT/IPBS Series) system
• Power Eye™ Board-to-Board system (HFWJ/FHP)
• Isolated Power Board-to-Board system ( IPS1/ IPT1)
• Q Strip® .8mm Board-to-Board system ( QTE/ QSE)
• Q2™ .635mm Board-to-Board system ( QMS/ QFS)
• Tiger Eye Board-to-Board system ( TFM/ SFM)
• "Hinge System" on PowerStrip/25™ Terminal/Socket Strip ( FMPT/ FMPS Series)

Power Integrity Guidelines include:

• The total path resistance through attachments and planes must be considered when sizing connectors for a power system.
• High current carrying power connectors should be placed as far away from the PCB edges as possible.
• Interweave power and ground pins to spread current across a larger surface area on the planes.
• Connectors with higher contact efficiency can be used in high current systems to reduce the size and cost of the power delivery system.

The number and thickness of power planes in the PCB has a direct effect on the routing of power traces. Efficient splitting of power over pins can greatly impact overall performance. Heat dissipation from the connector must also be considered when determining placement on a board in order to ensure optimum performance.

Learn more about our Power Testing Procedures.