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SamArray™ high
density interfaces have passed a 40 day mixed flowing gas testing which
exceeds Telecordia standards which projects a 20 year reliable life.
These .050" (1,27mm)
pitch interfaces (YFS/YFT/YFW
Series) are available with up to 500 I/Os and with board-to-board spaces
of 5mm (.197"), 7mm (.276"), 9mm (.354"), 12mm (.472"),
19mm (.748"), and 25mm (.984") between boards. They have solder
ball terminations for standard BGA processing.
FOURRAY™ headers
and sockets provide up to 200 I/Os in less than one square inch or 650
square millimeters, Board stack height choices are 6,35mm (.250"),
8mm (.315"), 10mm (.394") and 12mm (.472"). Surface mount
terminations (TOLC
and SOLC
Series) are on .025" (0,64mm) pitch while through-hole applications
(FOLC
and MOLC
Series) are on .050" (1,27mm) pitch.
FleXYZ™ 2mm
(.0787") pitch interfaces provide design flexibility in all three
planes by specifying the number of rows, pins per row and board spacing.
Headers and stackers (YTT/YTW
Series) mate with a choice of sockets (YTQ
and YTS
Series) to provide a range of board spacing . FleXYZ™ interconnects
are available with 4, 5 or 6 rows with up to 50 pins per row.
Z-Beam™ one-piece
interfaces (GFZ Series) provide high density board stacking and LGA socketing.
These solderless interconnects on .050" (1,27mm) pitch eliminate
solder joint realiability and solder pad delamination issues and minimize
Coefficient of Thermal Expansion (CTE) concerns.
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