• High Speed Array System
• Staggered pin layout reduces grounds
• No return paths needed
• No grounds needed so easier board routing
• Perimeter grounds simplify routing
• Fewer board layers
• Lower insertion/withdrawal forces than SamArray™
• Unique solder crimp on tails
• 10mm (.394") mated stack height
• Differential pair
• Up to 184 usable pairs
• View Performance Data
• Final Inch® information available
• DPAF, DPAM

• .050” (1,27mm) pitch array
• High Density - Up to 500 pins
• Flexibility to route as differential pairs, single-ended, or both
• Robust contact design:
  • Lower insertion/extraction forces vs. other array products
  • Allows "zippering" during unmating
• Up to 17.5mm mated height
• Right angle (in design)
• Unique solder crimp on tails
• Same footprint as SamArray®
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• View Maximum Pair Count Data
• Final Inch® information available
• SEAF, SEAF-RA, SEAM

• "Open Pin Field" design
• Intermateable with Molex Incorporated HD Mezz
• Elevated: 20, 25, 30 and 35mm stacks
• Better performance at taller stacks
• 299, 195, 143 pins
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• Final Inch® information available
• HDAF, HDAM

• One piece interface
• Solderless connection with compression tail
• Easy to replace
• .050" (1,27mm) pitch
• Up to 900 I/Os
• Low Profile - .065" (1,65mm) and .118" (3mm) heights available
• No solder pad delamination
• Minimizes Coefficient of Thermal Expansion issues
• No solder joint reliability or bent pin issues
• Allows field upgrade/exchange
• GFZ

• High Density Systems
• .050" (1,27mm) pitch
• Footprint on .025" (.635mm) pitch
• SMT and through hole
• ROLC, and FOLC features rugged Tiger Eye™ Contact
• TOLC, MOLC, FOLC, ROLC

Click here for a complete overview of Samtec's High Density Product Line.

* HD Mezz is a trademark of Molex Incorporated.