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High Speed Board-to-Board - High Density Arrays

SEARAY^™

High Density Open Pin Field Arrays

Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
Performance up to 18 GHz/pair
Up to 500 I/Os in open pin field design
1,27mm (.050") pitch and space saving 0,8mm pitch
Rugged Edge Rate™ contact system
Can be "zippered" during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Products (ELP) standards
7 - 17mm stack heights
Vertical, right angle, press fit
Elevated systems to 40mm
85Ω systems
VITA 47, VITA 57, Pismo 2 certified

SEARAY^™ LP Low Profile Arrays

Low Profile, High Density Arrays

4mm, 4.5mm, 5mm stack heights
Up to 180 I/Os
4 and 6 row designs
1,27mm (.050") pitch
Dual beam contact system
Solder charge termination for ease of processing
Performance up to 18.5 GHZ / 37 Gbps

Elevated HD Mezz

High Density Arrays

Appplication specific capability to stack from 20mm to 35mm
Open pin field design
Performance up to 9 GHz/pair
Integrated guide posts to minimize contact damage when mating and unmating
Solder charge terminations for ease of processing
1,2mm X 2mm pitch
Up to 299 I/Os
Intermateable with Molex HD Mezz
HD Mezz is a trademark of Molex Incorporated

DP Array^® (Differential Pair Array)

High density array optimizes pcb real estate

Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
No return paths needed
Fewer board layers required
Performance up to 4 GHz/pair (a terabit per pair)
Up to 168 usable pairs
10mm stack height
Lower insertion / extraction forces
Solder crimp termination

High Density, Low Profile Interfaces

Compression / One Piece

Z Beam® one piece contacts
Z Beam® System: ultra low profile, high density array

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1 800 726 8329

1-812-944-6733

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