A new era in connectivity has indeed arrived, and Samtec is ready to help you find the optimal interconnect solutions for your next design. Connect with Samtec experts at DesignCon 2024 to learn about new and existing products and technologies that support data rates up to 224 Gbps PAM4.
To register for DesignCon 2024, head to our show page to receive a free Expo Pass or a 15% discount for conference passes.
DesignCon Preview Podcast with Judy Warner
Join Us at Tuesday’s Welcome Reception!
Be our guest at the 2024 Welcome Reception Tuesday 30 January from 6-8 PM in the Hyatt’s Santa Clara Ballroom with a trip through a jungle safari.
Visit Booth 939 Wednesday and Thursday
Visit Samtec in Booth #939 to meet with our team members who are advancing standards development and pushing the state of the art to deliver the best signal and power integrity performance, whether your system is operating at 56 Gbps, 112 Gbps, or 224 Gbps.
Samtec’s world-renowned SI team has been examining the challenges of getting 224 Gbps design right and developing product and technology solutions. We stand ready to help you be successful with all of your designs, all the way up to 224 Gbps.
Around the Show Floor
Samtec products will also be featured in demos with our partners throughout the show floor. As you make your way around the expo, be sure to stop and see the technologies on display at Rohde & Schwarz (Booth #949) and Keysight (Booth #1039).
Meet the Experts Tuesday-Thursday
Samtec’s signal integrity and power integrity experts are authors and/or presenters at the following panels and papers:
Tuesday
Tutorial: How to Develop Advanced PCB Component Launches, Scott McMorrow. Tuesday, 30 January, 9AM, Ballroom B. Scott will be joined by Matt Commens, ANSYS, Inc.
Panel: Extreme Confidence Simulation for 400-800G Signal Integrity Design. Scott McMorrow, panelist. Tuesday, 30 January, 4:45-6PM, Ballroom B.
Wednesday
Paper: Comparing the Different Metrics of Intra-Pair Skew in Tracking Channel Performance, Richard Mellitz, Adam Gregory, Steve Krooswyk et al. Wednesday, 31 January, 11:15AM, Ballroom E.
Paper: Realistic Use Cases for Edge, Angled, and Vertical Launch Connectors up to 100 GHz, Sandeep Sankararaman, Gustavo Blando, Istvan Novak, Shawn Tucker. Wednesday, 31 January, 12:15PM Ballroom F.
Paper: 200 Gbps Signaling Per Electric Lane Over 1 Meter of Passive Twinaxial Copper Cable, Richard Mellitz et al. Wednesday, 31 January, 12:15PM, Ballroom C.
Sponsored Session: Simulation-to-Measurement Correlation of Multi-port devices with four-port VNAs, Anthony Fellbaum, co-presenter, Wednesday 31 January, 3:00PM, Great America Ballroom 2.
Panel: PCI Express: Pathway to 128 GT/s and Interoperability at 64 GT/s (PAM4), Steve Krooswyk et al., Wednesday 31 January, 4:00PM, Ballroom C.
Thursday
Paper: Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization, Istvan Novak, Gustavo Blando, Julia Van Burger, et al. Thursday 1 February, 9:00AM, Ballroom E. [Best Paper Award WINNER!]
Paper: Are 1.0mm Precision RF Connectors Really Required for 224 Gbps PAM4 Verification? Brandon Gore, Richard Mellitz, Andrew Josephson, et al. Thursday 1 February, 11:15AM, Ballroom F. [Best Paper Award WINNER!]
Paper: Survey on Correlation and Simulation Methodologies for PCB Structures through 67 GHz, Robert Branson, Greylan Smoak, Steve Krooswyk, Scott McMorrow. Thursday 1 February, 2:00PM, Ballroom C.
Sponsored Session: 112 Gbps PAM4 Interconnect Models Simplify Channel-Wide Modeling and Simulation, Anthony Fellbaum, co-presenter, Thursday 1 February, 3:00PM, Great America Ballroom J.
Get a Preview
At the January gEEk spEEk, see a preview of the above talks and demonstrations. Register here: Samtec gEEkĀ® spEEk Webinar Series – The Samtec Blog