• 2-4 layer designs for controlled impedance, minimized cross talk, and EMI shielding
• Mates to popular two-row high speed board-to-board interconnects
• High Speed Characterization reports available
• Cost effective price vs. performance – especially for medium to high volume applications.

• HFEM-DP - .8mm QTE/QSE Series, 3 layer (ground, signal, ground)
  View Performance Data
• HFEM2-SE - .8mm QTE/QSE Series, 2 layer (ground, signal)
  View Performance Data
• HFHM-DP - .5mm QTH/QSH Series, 3 layer (ground, signal, shield)
  View Performance Data
• HFHM2-SE - .5mm QTH/QSH Series, 2 layer (ground, signal)
  View Performance Data
• ZFHF-DP - .5mm ZIF to QTH or ZIF to ZIF, 2 layer (ground, signal)
  View Performance Data
• ERDL2 - .8mm ERM8/ERF8 Series, 2 layer (ground, signal)
• HSF8-DP/HSF8-SE - .8mm PCB to edge card interface, 4 layer rigid flex

• 4 layer rigid flex designs for controlled impedance, minimized cross talk, and EMI shielding
• Mates to SEARAY™ family of interconnects
• High Speed Characterization reports available
• Cost effective price vs. performance – especially for medium to high volume applications.

• SADL-DP/SADL-SE - .050”x.050” SEAM/SEAF Series, 4 layer rigid flex assembly, double row
  

• 2 layer designs for controlled impedance, minimized cross talk, and low cost
• Mates to popular two-row board-to-board interconnects
• High Speed Characterization reports available
• Cost effective price vs. performance – especially for medium to high volume applications.
• 3 layer RF jumper design for low cost internal cabling needs
  

• FFDL2 - .050” FTSH/CLP Series, 2 layer open pin field
  
• TCDL2 – 2mm TMMH/TLE Series, 2 layer open pin field
  
• TFMDL - .050” TFM/SFM Series, single layer low cost
  
• FSIF – 1mm FSI Series one piece interface, built in hardware. Single layer low cost
  
• RFDL2 – SMA Series, 3 layer shielded

Contact our Transmission Line Solutions Group
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Minimum Bend Radius Chart for our standard flex circuit assemblies
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Board-to-HFEM and Board-to-HFEM2 standoff
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