Samtec's High Speed Interconnects are available in the following configurations:

• Standard Stacking
• Shielded and Rugged Systems
• Open Pin Field Arrays
• Differential Pair Arrays
• Micro Card Interfaces
• Elevated Stacking

Q Strip®

• Choice of .5mm (.0197”), .635mm (.025”) and .8mm (.0315”) pitch
• .5mm (.197”) to 30mm (1.181”) mated heights
• Up to 240 I/Os depending on pitch
• Integral ground plane that can also be used for power
• Complete surface mount system
• View Performance Data
• Final Inch® Information available
• .8mm (.0315") - QTE, QSE
• .5mm (.0197") - QTH, QSH
• .635mm (.025") - QTS, QSS

• Optimized for 100 ohm system
• Differential pair interconnect system
• Choice of .5mm (.0197”), .635mm (.025”), and .8mm (.0315”) pitch
• Integral ground plane that can also be used for power
• Up to 80 pairs depending on pitch
• Complete surface mount system
• View Performance Data
• Final Inch® Information available
• .8mm (.0315") - QTE-DP, QSE-DP
• .5mm (.0197") - QTH-DP, QSH-DP
• .635mm (.025") - QTS-DP, QSS-DP

• EMI shielding attached to board via selected signal pins
• Increased insertion depth for rugged applications
• Dual stage hot pluggable
• Shielded and unshielded
• .025" (.635mm) pitch
• Up to 208 I/Os
• Differential pair available
• Edge mount, power, and non-shielded options available
• Guide post options
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• Final Inch® information available
• Shielded - QMSS, QFSS, QMSS-DP, QFSS-DP,
• Unshielded - QMS, QFS, QMS-DP, QFS-DP

• .635mm (.025") pitch
• 5mm (.197”) to 22mm (.866”) mated heights
• Double row with discrete through-hole ground plane
• Up to 266 I/Os
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• Choice of six mated heights
• 76 signal lines per linear inch
• MIT, MIS

• .8mm (.0315") pitch
• Up to 200 I/Os
• Contact designed for High Speed applications
• Robust Edge Rate contact improves "Zippered" unmating (more wipe, more cycles)
• Rated at 2.5 amps
• Lower cost
• Reduces broadside coupling
• Selective Gold plating
• 7mm (.276") and 10mm (.394") stack height
• Edge wipe contacts for reduced broadside coupling
• Edge Rate Emulation Family Flyer
• ERF8, ERM8, ERM8-EM, ERM8-RA, ERF8-RA, QRF8, QRM8

• 050” (1,27mm) pitch array
• High Density - Up to 500 pins
• Flexibility to route as differential pairs, single-ended, or both
• Robust contact design:
  • Lower insertion/extraction forces vs. other array products
  • Allows "zippering" during unmating
• 7mm (.276") - 17.5mm (.689") mated height
• Unique solder crimp on tails
• Same footprint as SamArray®
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• View Maximum Pair Count Data
• View Processing Report
• Final Inch® information available
• SEAF, SEAM, SEAF-RA

• "Open Pin Field" design
• Intermateable with Molex Incorporated HD Mezz*
• Elevated: 20, 25, 30 and 35mm stacks
• Better performance at taller stacks
• 299, 195, 143 pins
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• Final Inch® information available
• HDAF, HDAM

• One piece interface
• Solderless connection with compression tail
• Easy to replace
• .050" (1,27mm) pitch
• Up to 900 I/Os
• Low Profile - .065" (1,65mm) and .118" (3mm) heights available
• No solder pad delamination
• Minimizes Coefficient of Thermal Expansion issues
• No solder joint reliability or bent pin issues
• Allows field upgrade/exchange
• GFZ

• .050” (1.27mm) pitch array
• High Density – Up to 500 pins
• Tiger Eye™ Contact for highest reliability
• 5mm (.197”) to 25mm (.984”) mated heights
• Unique Solder Ball on tails optimizes reflow soldering
• Same footprint as SEARAY™
• View Performance Data – Single Ended
• View Performance Data – Differential Pair
• Final Inch® information available
• YFS, YFT

• High Speed Array System
• Staggered pin layout reduces grounds
• No return paths needed
• No grounds needed so easier board routing
• Perimeter grounds simplify routing
• Fewer board layers
• Lower insertion/withdrawal forces than SamArray™
• Unique solder crimp on tails
• 10mm (.394") and 17mm (.670") mated stack height
• Differential pair
• Up to 168 usable pairs
• View Performance Data
• Final Inch® information available
• DPAF, DPAM

• Flexibility in vertical and edge mount configurations
• 3 amp current rating
• Better performance at taller stacks than strips
• 1mm (.0347") pitch - MEC1, MEC1-EM, MEC1-RA
• .8mm (.0315") pitch - HSEC8-DV, MEC8-DV, MEC8-EM, MEC8-RA
• .635mm (.025") - MEC6-DV, MEC6-RA

• High speed micro plane connector
• SATALink™ compatible
• Mounts in pairs on same side or opposite sides for easy signal routing
• Variable mating card thickness
• Up to 40 positions
• Large deflection Beryllium Copper contact
• Can invert connectors and mount on top and bottom of board; this allows you to route on the top and bottom with vias
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• SAL1

• Four rows on 2mm (.0787") pitch
• Supports one, four, eight, and sixteen PCI Express links
• Up to 164 I/Os
• Accepts 1.6mm card
• Choice of card - edge mount or PCB mount
• Polarized and Alignment Pins
• PCIE

• High speed interface cards
• 19mm (.749"), 25mm (.975") and 30mm (1.182") standard board spacing, but custom stack heights are available
• Mates with vertical, right angle, and edge mount sockets
• Single-ended or differential pair signal routing
• Better performance at taller stacks than strips
• View Performance Data - Single-Ended
• View Performance Data - Differential Pair
• Final Inch® information available
• RU8

• 5mm (.197") through 30mm (1.182") stack heights
• .5mm (.0197"), .635mm (.025"), and .8mm (.315") pitch
• Single-Ended and Differential Pair
• .8mm (.0315") - QTE, QSE, QTE-DP, QSE-DP
• .635mm (.025") - QTS, QSS, QTS-DP, QSS-DP
• .5mm (.0197") - QTH, QSH, QTH-DP, QSH-DP

Click here to view Samtec’s High Speed Connector Bandwidth Selector Guides for either Single-Ended or Differential Pair assemblies.

Click here to view Samtec’s Industry Standards and Specifications for our High Speed Connectors.

For other questions on Samtec’s High Speed Connectors, contact our Signal Integrity Group  or complete our on-line Signal Integrity Services Support Form.

Click here to view and register for our on-going Signal Integrity E-mail Tips.

Click here to view our SO Series, Board-to-Board standoff for our High Speed Connectors.

*HD Mezz is a trademark of Molex Incorporated.