HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
High Speed Cable Assemblies
RF HIGH SPEED CABLE ASSEMBLIES
Test and Measurement Breakout Coax Assembly
Specifications
  • Pitch: .8mm (.0315”)
  • Cable: RG 178,  RG 316
  • Board Connectors: QTE or QSE Series
  • RF Connectors: SMA, MCX, or MMCX
  • Performance: 2.52 GHz at 12”
Series
  • EQRF – .8mm High Speed Coax/Connector Assembly

 
Features
  • Vertical and edge mount orientations
  • Available in 40 or 80 total positions
  • Optional captive screws
Additional Links
PCI Express® Breakout Cable Assembly
Specifications
  • Pitch: 1mm (.0394”)
  • Cable: 25 AWG Low Loss Coax
  • Board Connectors:
    • PCIE Edge Card
    • PCIE Edge Mount Socket
    • RF Connectors: SMA
  • Performance: 2.50 GHz at 18”
Series
  • PCRF – Breakout Cable Assembly

 
Features
  • Supports 1x, 4x, 8x, & 16x
  • PCIE Links Up to 164 positions

 

Additional Links

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
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