HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
IDC / Discrete Wire
.050" PITCH IDC SYSTEMS
.050” (1,27mm) Pitch IDC Assemblies
Specifications
  • Wire: 30 AWG
  • Contacts: Up to 50 I/Os
  • Current Rating: 0.5A per pin
Series
  • FFSD - Socket IDC Cable Assembly, Double Row
  • FFMD - Terminal IDC Cable Assembly, Double Row
  • EHF - Ejector Header Mate

 
Features
  • Socket assembly features high performance, low profile TigerEye™ contacts
  • Ejector header available
  • Socket and terminal assembly available
  • RoHS compliant
Additional Links

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
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