FOR IMMEDIATE RELEASE:
Samtec, Inc. has been named a DesignVision Award finalist in the PCB Design Tools category for development of its Final Inch® product for streamlining the layout of the PCB signal breakout region around high speed connectors.
The DesignVision Awards program recognizes technologies, applications, products, and services judged to be the most unique and beneficial to the industry. Finalists are judged based on the Innovation, Uniqueness, Market Impact, Customer Benefits, and Value of the product to society. The awards will be presented at DesignCon 2005 during a special media reception on Tuesday, February 1.
Samtec Final Inch® provides a greatly reduced PCB design effort leading to lower development costs and significant reductions in product time to market. It is based on a reference design with proven manufacturability, performance, and cost-effectiveness for high speed signal routing on a PCB around a connector. This signal breakout region is extremely critical for its impact on signal integrity of high bandwidth systems. Performance degradation resulting from this small section of the PCB and its related connector is often the most significant factor limiting total interconnect bandwidth.
Samtec is presenting a TecPreview at DesignCon on Tuesday, February 1 at 9:40 AM PST to provide an overview of Final Inch® features and benefits. Samtec will also be providing a demonstration of Final Inch® at booth 512 during show hours.
For
more information on Samtec's TecPreview or Final Inch®,
contact:
Samtec,Inc. •
P.O. Box 1147 • New Albany IN 47151
Phone: 1-800-SAMTEC-9 (USA &
Canada) • 812-944-6733
Web: www.samtec.com
• Email: finalinch@samtec.com