Samtec to present TecPreview paper
and exhibit at DesignCon 2005

Samtec's TecPreview presentation,
"Final Inch® - A Plug-and-Play Reference
Design Solution for High Speed Interconnects"
will be held on Tuesday, February 1, at 9:40am.

This TecPreview presentation focuses on Samtec's reference design solution for high speed signal routing on a PCB near a connector. This break out region is extremely critical for its impact on signal integrity of high bandwidth systems. Performance degradation resulting from this small section of the PCB and its related connector is often the most significant factor limiting total interconnect bandwidth. Click here for more information on Samtec's TecPreview Presentation.

Visit Samtec at booth number 325 on Tuesday, February 1st through Wednesday,
February 2nd to see a demonstration of Samtec Final Inch®.

Samtec Final Inch® is a finalist for the inaugural DesignVision Awards in the PCB Design Tools Category. Click here for more information on the DesignVision Awards.

Click here for a complimentary admission to exhibits, key note speakers, and conference panels and receive a 30% discount off the education program as a special guest of Samtec.

Click here for more information on DesignCon .