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Please visit Samtec at Booth number 215 on Tuesday, January 31, and Wednesday, February 1,from 12:30 pm to 6:00 pm PST during the show to see where signal integrity products, services and tools intersect with Samtec SI Fusion and enter our FREE iPad Giveaway.
SI FUSION
Samtec is uniquely positioned to provide complete end-to-end interconnect solutions that  make your entire system faster, thinner and lighter, across longer distances with lower overall costs. Samtec SI Fusion capabilities are offered with full engineering, signal integrity, design, and prototyping support.
FREE PASS
If you plan to attend DesignCon 2012, please click the link
below to obtain your free DesignCon 2012 VIP Exhibition
Plus Pass and a discount on the education program
courtesy of Samtec.
Remember - use this registration
discount code to receive Samtec sponsored discounts - EXPASS
Click here for VIP Pass
Learn more about DesignCon 2012
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Samtec will present the Technical Paper, “Connector Models - Are They Any Good?”
Wednesday, February 1, 10:15 am-10:55 am
Ballroom G.
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on PCB materials (Copper finish, dielectric moisture absorption), other elements within the channel have been largely ignored. In this session, we look at the variation of performance of a high density connector including insertion depth, return path via location and solder variations. Model validation using measurements is only possible if the reference plane locations are common between the measurement and model. Measurement details including the impact of calibration structure on correlation are presented. Model quality metrics using FSV are also introduced.
Click HERE to see a more detailed summary of
Samtec's
presentation.
"Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains"
Samtec has co-authored this paper with DuPont. Tuesday, January 31 at 8:30-9:15 am
Great America Room J.
A thorough analysis of measured propagation properties in both frequency and time domain is presented for both flex and thin rigid transmission lines. This work is presented in three phases. The first phase is an "apples-to-apples" comparison of flex and thin rigid materials. Some of the variables analyzed are amount of fluoropolymer in the material, type of Copper, profile of Copper, surface finish and cover layer adhesive. In the second phase, design parameters like DK, DF and Roughness are extracted and compared to simulated results utilizing equation-based methods and electromagnetic solvers. Two different approaches to parameter extraction are compared. Both methods are verified by comparison of simulated to measured results. In the third phase, the extracted design parameters are utilized to assess the performance differences between different materials in a Generation 3 PCI-Express application.
Click HERE to see a more detailed summary of Samtec's presentation. |
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