| DATE |
TITLE
|
AUTHOR/
PUBLICATION
|
FIND
OUT
MORE
|
DOWNLOAD
ZIP FILE
|
| _WHITE
PAPERS
|
02/08 |
Power
Testing Standards White Paper |
Samtec,
Inc. |
|
|
01/08 |
Samtec
Standard Cable Shielding Performance |
Samtec
Jim Nadolny, Cesar Arroyo |
|
|
10/07 |
Understanding
Voltage and Power Ratings |
David Scopelitti
D-Scope-Tech Inc. |
|
|
09/07 |
HFEM-SE
High Speed Flex Data Link SPICE Model Validation Report |
Kieran Kelly
|
|
|
08/07 |
Linear
vs. Non-Linear Contact Analysis |
Brian
Vicich, Craig Ryan,
Kevin Meredith,
Samtec |
|
|
08/07 |
Solectron
HD Mezz Connector Processing Trial SMT Assembly Report |
Solectron, Molex, Samtec |
|
|
08/07 |
EMI
Design of Shielded Cable Assemblies |
IEEE,
Jim Nadolny
Samtec, Inc. |
|
|
08/07 |
Contact
Plating Effects on Signal Integrity – QTE-028-07-L-D-DP-A Mated
with QSE-028-01-L-D-DP-A |
Corey
Kimble
Samtec |
|
|
08/07 |
Contact
Plating Effects on Signal Integrity – QTE-020-07-L-D-A Mated
With QSE-020-01-L-D-A |
Corey
Kimble
Samtec |
|
|
08/07 |
Contact
Plating Effects on Signal Integrity – QTE-028-01-L-D-DP-A Mated
With QSE-028-01-L-D-DP-A
|
Corey
Kimble
Samtec |
|
|
08/07 |
Contact
Plating Effects on Signal Integrity – QTE-020-01-L-D-A Mated
With QSE-020-01-L-D-A
|
Corey
Kimble
Samtec |
|
|
06/07 |
Ribbon
Cable Assembly Comparision Summary |
Jim
Nadolny & Justin McAllister, Samtec, Inc. |
|
|
05/07 |
The
Development and Verification of Mixed Potential Integral Equation
Field Solvers in Electromagnetics |
J. Rodgers &
K. Chuang |
|
|
05/07 |
Lubricant
use in Connector Systems Improves Cycles and Wear |
Brian Vicich,
Samtec, Inc. |
|
|
04/07 |
A
Comparison of the Edge Rate vs. Stamped/Cut Contact |
Samtec |
|
|
08/06 |
A
Novel Procedure for Characterization of Multiport High-Speed Balanced
Devices |
Vahe' Adamian
& Brad Cole
Ultrimetrix |
|
|
06/06 |
Hardware
specification for Rocket-IO Serial Link (RSL) |
Sundance |
|
|
01/06 |
Using
the Agilent Physical Layer Test System (PLTS) For Acquiring Time
Domain Data |
Samtec |
|
|
01/06 |
Universal
LVDS Ribbon Cable |
Marc Defossez,
Xilinx, Inc. |
|
|
12/05 |
Lead-Contamination
in Lead-Free Electronic Assembly |
AIM, Inc. |
s
|
s |
12/05 |
TDR
for Differential Pair Characterization |
Abe Riazi,
Interconnect Strategies |
s
|
|
12/05 |
TI
Connecting ADS8410/13 with Long Cable |
Bhaskar Goswami,
Rajiv Mantri
Texas Instruments
|
|
|
| |
|
|
|
|
11/05 |
|
David Naylor
Xilinx, Inc., Xcell Journal |
|
|
11/05 |
Selecting
Connectors for Multi-Gigabit Transceiver Designs |
Marc Defossez
Xilinx, Inc., Xcell Journal |
QSE/QTE,
YFS/
YFT
|
|
10/05 |
RocketIO
MGTs with High-Speed Samtec QTE/QSE Connectors and EQCD-EQDP Cable
Assemblies |
XILINX
|
QSE,
QTE,
QTE-DP,
QSE-DP,
EQCD, EQDP |
|
09/05 |
TDR
for Differential Pair Characterization - Part 1 |
Abe Riazi
Interconnect Strategies |
s |
|
08/05 |
Dynamic
Range Determination and S-Parameter Accuracy Validation For High Frequency
Time Domain Network Analyzer (TDNA) Measurements |
Tom Custer |
s
|
|
07/05 |
Comparison
of Eye Patterns Generated by Synopsys HSPICE and the Agilent PLTS |
Jim Nadolny |
s |
|
07/05 |
EQCD
High Data Rate Cable Assembly Spice Model Validation Report |
Kieran Kelly |
|
|
01/05 |
Part
1 - Golden Standard Overview |
Julian Ferry,
Dan Piscotty, Samtec, Dr. Richard Elco, Independent Consultant |
s |
|
01/05 |
Part
2 - Golden Standard Transmission Line Theory |
Julian Ferry,
Dan Piscotty, Samtec, Dr. Richard Elco, Independent Consultant |
s |
|
01/05 |
High
Speed MMCX Competitive Comparison Report |
Samtec |
s |
|
11/04 |
Supplemental
high Speed Characterization Report - Fold Comparison Report - HFEM2-014-T-05-00-DP |
Samtec |
|
|
06/04 |
Comparison
of Vector Network Analyzer and TDA Systems IConnect® Generated
S-Parameters |
Kieran Kelly |
|
|
06/04 |
HFEM
Series -- Copper Shield and Silver-Ink Shield |
Russ Moser, The
Orion Group, Kieran Kelly, Samtec |
|
|
01/04 |
Flex
Characterization |
Scott McMorrow
Teraspeed |
|
|