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Select a Samtec Brand Name from the list below to retrieve a list corresponding Samtec products.
Brand Name Application
AccliMate™ Sealed Circular Plugs and Receptacles for IP67/IP68 applications where a rugged, water tight connector is needed.
Align & Latch Rugged connectors designed to lock together and are ideal for high vibration and shock applications.
Blade-n-Beam Micro Pitch Contact System designed to be mating/alignment friendly and cost effective.
Data Rate (High Speed Cable) High Speed Cable Assembly systems provide flexible solutions to meet strigent signal intergrity specifications on a variety of centerlines and configurations.
DataBank™ High speed cable assembly utilizing 30 AWG, 100 ohm twinax cable, optimizes signal integrity with no transition board between the cable and contacts.
DP Array™ Differential Pair Array maximizes bandwidth per square inch of board area ideal for High Density and High Speed applications
Edge Rate Designed for High Speed applications, this robust contact improves "Zippered" unmating
Flex Circuits High Speed Flex Data Links for Signal Integrity Applications from 60mm to 200mm
FleXYZ™ Interfaces that provide design flexibility in all three planes (X,Y,and Z axis) by specifying the number of rows, the number of pins per row, and the desired board spacing all with standard interconnects.
FOURRAY™ Four row terminal and socket strips ideal for High Density applications
HD MEZZ Elevated High Density Array with a open pin field for Single-Ended or Differential Pair configurations ideal for High Density and High Speed applications
I/O Interfaces D-subs, modular jacks, miniature DINs, and high speed serial interfaces for all your I/O applications.
ISORATE Lower cost alternative to machined RF connectors; ideal to isolate signals. About half the cost and 85% of the performance of machined RF.
Micro Card Unique low profile, high speed card-to-board interface for serial ATA™ and other high speed daughtercard applications.
Mini Mate® Interconnects designed for power applications that require up to 4 Amps of current capacity.
Mixed Technology Interconnect system with both through-hole and surface mount leads that provides additional strength for high cycle, high vibration applications.
Power Buy™ Contact System designed for power applications up to 7 Amps of current carrying capacity.
Power Eye™ Contact System designed for power applications up to 15 Amps of current carrying capacity.
Power Mate™ Interconnects designed for power applications that require up to 13 Amps of current capacity.
Power Strip Power interconnect system rated up to 30A per contact. Vertical, right angle, and combination power/signal pin configurations available.
Press Fit 2mm Press Fit headers and sockets ideal for High Density applications.
Q Pairs® High Speed Differential Pair terminals, sockets, and cable assemblies that allow customers to route signals out-of-phase for improved electrical performance.
Q Strip® High Speed terminals, sockets, and cable assemblies with controlled impedance that can be routed either single-ended or differentially for enhanced signal integrity.
Q2™ Shielded connector system provides EMI suppression ideal for High Speed applications.
QRATE The next generation Q Strip interconnect – footprint compatible with Samtec’s popular Q Strip (QTE, QSE Series), but utilizes the rugged Edge Rate contact.
RiseUp® High Speed board with embedded ground plane mates with micro edge card connectors for greatly improved performance over traditional connector sets for elevated board stacking.
Rugged™ High reliability, high cycle, and high retention contacts, shrouded and keyed insulators with positive retention features, and PCB terminations including press fit, solder locks and mechanical hold-down options that are ideal for high reliability applications.
SamArray® Mating system that provides high density, high speed, and high reliability with standard board-to-board interconnects.
SEARAY™ Open Pin Field Array with lower insertion/extraction forces ideal for high density and high speed applications.
Spirit Test Probe Non-intrusive testing compatible with Intel specific PCI Express protocol footprint. Replaceable contact arrays extend probe life indefinitely.
Storage Combo These combination signal and power connectors eliminate the need for the flat ribbon cables and power wire harnesses that are commonly used when connecting hard drives.
Tiger Beam™ Post and Beam Contact System with reliable performance and consisdered the best cost of all Samtec contacts.
Tiger Buy Tuning Fork Contact System with high mating and unmating retention and cost effective.
Tiger Claw™ Dual Wipe Contact System ideal for pass-through applications and ultra low profile.
Tiger Eye Lite™ Multi-Finger Contact System ideal high reliability applications.
Tiger Eye™ Multi-Finger Contact System ideal for high reliability and high mating cycle applications.
Tiger-Eye-IDC Multi-Finger IDC Cable Contact System ideal for high reliability and high mating cycle applications.
Z Beam® Solderless Contact System ideal for high density and low profile applications.
 
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