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SUMIT™ - Stackable Unified Module Interconnect Technology

SUMIT is an electromechanical connectorization specification that enables all common serial and legacy chipset expansion busses for next generation products. It is a stackable, I/O-centric, serial expansion approach that is independent of any particular board form factor. It supports PCIe, USB, LPC, SMBus, and ExpressCard signals on a single high-speed connector. A second connector supports additional PCIe lanes.

Interface signals included in SUMIT™:

  • Two x1 channels of PCI Express (including clock and card present)
  • One x4 channel of PCI Express (including clock and card present)
  • Three USB 2.0 channels
  • One ExpressCard channel
  • Two SPI/uWire channels
  • LPC interface with serial IRQ support
  • System Management Bus (SMBus)/I2C with SMD Alert
  • Reset and Wake On LAN (WAKE)

The SUMIT™ standard specifies Samtec's Q2 QMS/QFS Series in a one bank (52 pin) orientation for module stacking. Samtec specifically designed the QMS/QFS Series with a 15.24mm stack height for top and bottom board stacking. Q2 has triple the wipe of many high speed mezzanine interconnects making it appropriate for rugged applications.

Samtec also offers precision machined standoffs to limit the impact of tolerance stack up issues in stackable embedded applications.

SO-1524-03-01-02-L – 15.24mm standoff

Samtec is a member of SFF-SIG. For more information on SFF-SIG, please click here.