The SUMIT™ standard specifies Samtec's Q2™ QMS/QFS Series in a one bank (52 pin) orientation for module stacking. Samtec specifically designed the QMS/QFS Series with a 15.24mm stack height for top and bottom board stacking. Q2™ has triple the wipe of many high speed mezzanine interconnects making it appropriate for rugged applications.
For elevated board stack in applications where processors need bigger heat sinks; Samtec has created the ASP (application specific product) male QMS versions which mates to the female QFS for the 22mm mated height:
To obtain samples or information on the part numbers listed on this page, click on one of the links below:
Samples
Pricing and Delivery
3D Models
PADS
Samtec also offers precision machined standoffs to limit the impact of tolerance stack up issues in stackable embedded applications.
SO-1524-03-01-02-L - 15.24mm standoff
SO-2200-03-01-02-L - 22.00mm standoff
Samtec is a member of Small Form Factor Special Interest Group (SFF-SIG). For more information on SFF-SIG, please click here.
Click
here to view a white paper from VersaLogic on "Increasing Bandwidth and
Connectivity in Small Form, High-Performance Embedded Applications: The
I/O-Centric, High-Speed SUMIT Interconnect Standard."
For additional information, contact our Standards Group.
SUMIT is an interconnect and signaling bus specification only. For more information on the PCB form factor specification using the SUMIT standard, such as Pico-ITXe™, Pico-I/O™, and SUMIT-ISM™, contact the Standards Group for more information. |