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The SUMIT™ standard specifies
Samtec's Q2™ QMS/QFS Series in a one bank (52 pin) orientation for module
stacking. Samtec specifically designed the QMS/QFS Series with a 15.24mm stack height
for top and bottom board stacking. Q2™ has triple the wipe of many high speed
mezzanine interconnects making it appropriate for rugged applications.
For elevated board stack in applications
where processors need bigger heat sinks; Samtec has created the ASP (application
specific product) male QMS versions which mates to the female QFS for the 22mm mated
height:
To obtain samples or information
on the part numbers listed on this page, click on one of the links below:
Samples
Pricing and Delivery
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SUMIT™ Connectors
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Samtec
PN
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Prints
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PADS
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3D Models
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ASP-129637-01
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ASP-129646-01
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ASP-142781-01
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Samtec also offers precision machined
standoffs to limit the impact of tolerance stack up issues in stackable embedded
applications.
SO-1524-03-01-02-L - 15.24mm standoff
SO-2200-03-01-02-L - 22.00mm standoff
Samtec is a member of Small Form
Factor Special Interest Group (SFF-SIG). For more information on SFF-SIG, please
click here.
Click
here to view a white paper from VersaLogic on "Increasing Bandwidth and
Connectivity in Small Form, High-Performance Embedded Applications: The I/O-Centric,
High-Speed SUMIT Interconnect Standard."
For additional information, contact
our Standards Group.
SUMIT
is an interconnect and signaling bus specification only. For more information on
the PCB form factor specification using the SUMIT standard, such as Pico-ITXe™,
Pico-I/O™, and SUMIT-ISM™, contact
the Standards Group for more
information.
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