| AC
Coupling - Method of interfacing drivers and receivers through
a series capacitor. Often used when the differential swing between drivers
and receivers is compatible, but common mode voltages of driver and receiver
are not. Requires that a minimum data frequency be established based on
the RC time constant, necessitating a run length limit.
AccliMate™ -
Sealed Circular Plugs and Receptacles for IP67/IP68 applications where
a rugged, water tight connector is needed.
Agilent Logic
Analyzer – Agilent
high speed logic analyzer 16760A that mates to Samtec test point connector
ASP-65067-01.
Align & Latch - Rugged connectors designed to lock together and are
ideal for high vibration and shock applications.
Analysis Probe
- A test cable used to connect a logic analyzer to a test point connector.
Application Notes
- how our connectors work in various industry standard signaling architectures
like PCI Express, XAUI, SATA, and Rapid I/O. We have tested Q Pairs®,
SamArray, DP Array, SEARAY™, and Q2. Information is available in
the Signal Integrity area of our web site.
Attenuation (Measured in decibels "dB") - The amount
of signal loss for which the connector is responsible. Other similar words
are Loss and Attenuate. A term typically used in reference to long transmission
lines like cables. (See also SIG, SIC, SIS, SI, Clock Speed, Bandwidth,
Frequency, or Data Rate, or Insertion Loss).
AWG (American
Wire Gage) - Typically expressed as simply "Gage" (ie. 30 AWG
reads as "thirty gage"). The number preceding the AWG expresses
the size or diameter of the cable. The larger the number, the smaller
the diameter; the smaller the number, the larger the diameter. 1 AWG is
roughly the diameter of a dime or a nickel. 38 AWG is smaller then the
diameter of your hair. AWG is used in describing cable size, either as
stranded or solid, for both standard cable and coax & twinax cables.
(See also Insertion Loss, Coax, Twinax, HDR, DR, SDR, or XDR)
Backplane - A structural interconnection panel into which PC Boards
or their panels can be plugged. A backplane is sometimes called a motherboard.
Bandwidth - The maximum frequency at which signals are sent through
a system. Another similar term is frequency. It's expressed in terms of
GHz, MHz, or KHz and should not to be confused with data rate or clock
speed. Bandwidth can be Aggregate per Line or per Pair Bandwidth. (See
SIG, SIC, SIS, SI, Data Rate, Frequency, or Clock Speed)
Bandwidth Performance
Selector Guides - A reference chart that provide performance data
for our high speed connectors and cables in both single-ended and differential
pair configurations based on either the 10% impedance mismatch or cross
talk fail point for connectors or -3dB insertion point loss for cables.
This is not the maximum these connectors can perform to but a guide in
helping customers determine a connector system the meets their system
requirements. Connectors will soon also be rated to the -3dB insertion
loss point as well. These charts are available in the Signal Integrity
area of our web site. (See also Good-to-Charts)
BGA (Ball Grid Array) - An IC packaging method where the contact
points solderballs arranged in a grid pattern. This is similar to a LGA
(land grid array), but with solderballs. (See also Solder Crimp or IPG)
Blade-n-Beam - Micro
Pitch Contact System designed to be mating/alignment friendly and cost
effective.
Blade Contact - A flat metal contact typically used in multiple
contact connectors.
Body - The insulating part of an interconnect. Other terms used
are Housing and Plastic.
Build a High Speed Cable - an interactive program to assist customers
in creating a valid Data Rate cable assembly part number. Found in
the High Speed Cable area of the web. (see also High Speed Cable Builder)
Burn-in - Testing at an elevated temperature in order to accelerate
failure in components with defects so as to eliminate them prior to placement
in service.
Butt Joint - A solder joint where the end of the lead sits on
the solder pad.
Cable Performance Calculator - an interactive program to assist
customers in determining the approximate data rate/frequency for a HDR
or Flex cable assembly based on the cable type, length, and allowable
insertion loss.
Capillary Action - The effect of surface tension that draws a
liquid into a small opening. Typically used in the context of manufacturing
or processing of connectors relating to solder, flux, lubricants, or
other fluids. (See also IPG)
CAT3 - A premise wiring specification that defined network interconnection
performance in the 1980s. Well matched to 10 BaseT Ethernet, CAT3 is
still very popular today. Most 10/100 BaseT applications are satisfied
with this performance level in the ModJack and Plug.
CAT5 - The 1990s saw pressure to raise the bar in network performance.
CAT5 replaced CAT3 and is still the highest performing ModJack required
for Ethernet applications. Gigabit Ethernet (1000 BaseT) calls out CAT5
as its required level of performance.
CAT5e - The need for headroom in high speed networks is driving
Category 5e. CAT5e was ratified in 1999 and is an incremental improvement
designed to support full duplex Fast Ethernet operation and Gigabit Ethernet.
Clock/Data Recovery - Feature of most high-speed serial transcievers.
At the receiver, a clock is generated based on the timing of data transitions.
In this way, a clock signal is derived from the data.
Clock Period - the time interval to repeat one clock cycles usually
measured in nanoseconds.
Clock Speed - The speed at which the reference timing is timed.
Not to be confused with frequency, bandwidth, or data rate. Typically
expressed in Gb/sec. The clock speed is the inverse of the clock period.
(See also Clock Period, Frequency, Data Rate, Bandwidth, SIG, SIS, SIC,
or SI)
Coax (coaxial cable) - A single conductor that is insulated by
a dielectric and then surrounded by a ground/shield and an outer jacket.
Typically used in context with AWG American Wire Gage (a 30 AWG coax).
(See also HDR, DR, SDR, XDR, or twinax)
Common Mode - The DC component of a signal. In differential
channels, it is the average voltage of the differential pair.
Contact - The conducting part of an interconnect at the interface
between the connector and the lead on the device being connected.
Contact Resistance - The resistance at the point of connection
determined by the contact geometry, area of contact, plating, and normal
force. It is typically expressed in terms of milliohms because contacts
are supposed to conduct electricity, and the resistance is typically very
small. (See also LLCR (Low Level Circuit Resistance), or ESG)
Convection - The transfer of heat by movement of hot air. It is
often used in conjunction with infrared radiation to reduce the effect
of IR shadowing, and is typically used in the context of heat transfer
or in a manufacturing process like Convection or Reflow Oven. (See also
IPG)
Coplanarity - The distance between the lowest and highest lead
when the connector is laying on its seating plane, and is typically expressed
in thousands of an inch or millimeters. On a print, it is typically the
number shown in a box next to the semi-circle shaped figure in a box.
(See also IPG)
Cross Talk - The amount of signal that couples (or "jumps")
between adjacent signal lines or contacts. It is sometimes called "noise"
or "coupling" X-talk, NEXT (Near End Crosstalk), FEXT (Far End
Crosstalk) and is measured in decibels "dB". (See also SIG,
SIS, SIC, or SI)
Data Rate - The number of bits or signals sent through a system
per second and is typically expressed in terms of xx bps, xx bits/sec,
Gbps, or Mbps and is not to be confused with Clock Speed or Bandwidth.
(See also SIS, SIC, SIG, SI, Frequency, Bandwidth, or Clock Speed.)
Data Rate
(High Speed Cable) - High Speed Cable Assembly systems provide flexible solutions
to meet strigent signal intergrity specifications on a variety of centerlines
and configurations.
DC Coupling - Method of interfacing drivers and receivers
without the use of series capacitors. A direct connection (through
PCB trace) from driver to receiver.
Deterministic Jitter - The component of jitter attributable
to the data pattern in the channel. Different digital patterns have
different spectral contents. These differing spectral contents give
rise to varying amounts of signal jitter.
Dewetting
- A situation where a lead or pad was at one point in the soldering process
wetted by the solder, but due to extended time or temperature, the presence
of intermetallics, volatiles or other causes, has become withdrawn from
the wetted surface. (See also IPG)
Differential Signals - One signal per two pins in a connector:
one in phase, one out of phase. Or opposite polarities. Typically synonymous
with 100 Ohm system designs. Example: CAT 3 and CAT 5 is a type of phone
line or Ethernet connection you typically use with twisted pairs. Typically
also synonymous with twinax. (See Twisted Pair, Twinax, SIG, SI, SIC,
SIS, HDR, DR, SDR, or XDR)
Digital Video Interface (DVI) - This is a precursor to the HDMI
and is a specification to fit analog and digital monitors with a single
connector.
DIN - European standard that specifies the characteristics of
certain connectors in the electronics industry.
Discontinuities
- Change in the properties of a physical system in which an electric signal
is traveling. Discontinuities often lead to signal time or amplitude degradation.
DP Array™ -
Differential Pair Array maximizes bandwidth per square inch of board
area ideal for High Density and High Speed applications.
Edge Rate - Designed
for High Speed applications, this robust contact improves "Zippered" unmating.
EIA (Electronic Industries Alliance) - A standards organization
for electrical and mechanical testing procedures. EIA-364 is a term
commonly referred to as the defacto standard for connector testing.
Samtec uses and follows EIA-364 for almost all standard connector testing.
(See ESG)
Electroplating - A method of electrically depositing metals
of very precise compositions and thickness' onto a base metal. Typically
expressed in terms of micro-inches, or u". Example: 30 u" Au
expresses "thirty micro-inches of gold electroplating" (See
also IPG)
Electromagnetic Interference - Electromagnetic interference (EMI)
is any electromagnetic disturbance that degrades or limits the performance
of the considered electronic system. It can be induced by the system
being considered or its environment. The amount of interference an equipment
can emit is regulated.
End Stackable - The ability to stack connectors end-to-end on
a solid grid without wasting board space between connectors.
Engineering Support Group (ESG) - Samtec has formed this group
to handle Test Lab related questions from customers. The Test Lab and
ESG is equipped to handle any specialized electrical, mechanical , or
environmental testing and answer questions relating to such concerning
our connectors and cables. Their email address is ESG@samtec.com.
EPIC - EPIC is a consortium sanctioned technical standard that was created
in 2004 to help bridge the gap between PC/104 and the EBX standards.
Equalization - Amplification or attenuation of certain
frequency components of a signal. Used to counteract the effects of
a non-ideal transmission medium.
Eutectic Solder - The most common solder alloy because of its
low melting point (183oC) composed of 63% Tin and 37% Lead. (See also
Lead Free Solder or IPG)
Eye Diagram - An eye diagram of a signal overlays the
signal? waveform over many cycles. Each cycle? waveform is aligned to
a common timing reference, typically a clock. An eye diagram provides
a visual indication of the voltage and timing uncertainty associated
with the signal. It can be generated by synchronizing an oscilloscope
to a timing reference.
The vertical thickness of the line bunches in an eye diagram indicate
the magnitude of AC voltage noise, whereas the horizontal thickness of
the bunches where they cross over is an indication of the AC timing noise
or jitter. Fixed DC voltage and timing offsets are indicated by the position
of the eye on the screen.
Eye Mask - The size of the eye opening in the center
of an eye diagram indicates the amount of voltage and timing margin available
to sample this signal. Thus, for a particular electrical interface, a
fixed reticule or window could be placed over the eye diagram showing
how the actual signal compares to minimum criteria window, know as the
eye mask. If a margin rectangle with width equal to the required timing
margin and height equal to the required voltage margin fits into the
opening, then the signal has adequate margins. Voltage margin can often
be traded of for timing margin.
Far End Cross Talk (FEXT) - the measured noise on the end farthest
from the signal source.
Fillet - A smooth, concave junction where two surfaces meet. The
quality of a solder fillet determines the strength of the joint. (See
also IPG)
Final Inch® - a real-world reference design to make Samtec the
easiest high speed connectors to design in. Final Inch consists of Physical
Models, Electrical Models, Test and Evaluation Kits, and Empirical Signal
Integrity Data. Information can be found in the Signal Integrity area
of our web site.
Flash - When referring to molded parts, this is a thin line of
material at the surface where the die parts. When referring to plating,
it is a very thin layer of metal usually less than 10 micro-inches thick.
(See also IPG)
Flex Circuits - High
Speed Flex Data Links for Signal Integrity Applications from 60mm to
200mm.
Flexible Printed Circuitry - This is similar to a PCB, but
is flexible and uses Kapton® (or more commonly referred to as polyimide)
instead of rigid FR4 in most cases. This sometimes is referred to as
FPC or Flex. (See also SCF, Flex Group)
FleXYZ™ - Interfaces
that provide design flexibility in all three planes (X,Y,and Z axis)
by specifying the number of rows, the number of pins per row, and the
desired board spacing all with standard interconnects.
Footprint - The pattern on the printed circuit board to which
the leads on a surface mount component are terminated or soldered to
also called a land or a pad. (See also IPG)
FOURRAY™ -
Four row terminal and socket strips ideal for High Density applications
Fretting - A form of tin corrosion caused by vibration. (See
also IPG)
Frequency - The number of repetitions per unit of time of a complete
waveform as of an electrical current and is expressed in Hz or Hertz
(the inverse of time or Hz = 1/sec), GHz, MHz, or KHz. It can be expressed
as the sum of many transmission lines (aggregate) or just one transmission
line (per line or per pair). (See also Bandwidth, Data Rate, Clock Speed,
SIG, SI, SIS, or SIC)
Frequency Domain - a mathematical construct where very specific
rules are followed and that the only kind of wave forms exist are sine
waves. Sine waves are the language of frequency domain.
Golden Standard - a paper and reference board that validates our
test procedures and our modeling/simulation. Information on this can
be found in the Signal Integrity area of our web site.
Gas Tight - A connection with sufficient contact pressure to keep
contaminating gases from entering the contact area and degrading the
electrical connection over time. (See also ESG)
Gigahertz (GHz) - One billion Hertz. One hertz is the inverse
unit of time in terms of seconds: 1 Hz = 1/sec. (See also Frequency,
Clock Speed, Bandwidth, SIG, SI, SIS, or SIC)
Grounding - Establishing a connection in an electrical
circuit or equipment between earth ground or electrical ground.
Good-to-Charts - A reference chart that provide performance data
for our high speed connectors and cables in both single-ended and differential
pair configurations based on either the 10% impedance mismatch or cross
talk fail point for connectors or -3dB insertion point loss for cables.
This is not the maximum these connectors can perform to but a guide in
helping customers determine a connector system the meets their system
requirements. Connectors will soon also be rated to the -3dB insertion
loss point as well. These charts are available in the Signal Integrity
area of our web site. (See also Bandwidth Performance Selector Guides)
Gull Wing - A surface mount lead configuration where the leads
are normally bent out and are parallel to the bottom of the interconnect
and to the board. (See also IPG)
HD Mezz -
Elevated High Density Array with a open pin field for Single-Ended
or Differential Pair configurations ideal for High Density and High
Speed applications
HDMI - HDMI (high definition multimedia interface) is an industry standard
for audio and video interfaces and specifies an all-digital audio and
video signal via one cable.
Heat Treating - A process that uses precise time and temperature
controlled heating and cooling of metals after stamping and forming in
order to optimize internal stresses and spring properties.
Hertz - A unit of measurement for analog speed. One hertz is the
inverse unit of time in terms of seconds. 1 Hz = 1/sec. (See also Frequency,
Clock Speed, Bandwidth, SIG, SI, SIS, or SIC)
High-Definition Multimedia Interface (HDMI) - This is the first
industry supported, uncompressed, all digital audio/video interface.
HDMI provides an interface between any audio/video source, such as a
set top box, DVD player, and A/V receiver, and an audio and/or video
monitor, such as a digital television (DTV).
High-Speed Characterization Report - A summary document of a more
extensive RF validation report. (See also Frequency, Propagation Delay,
Insertion Loss, Crosstalk, SIG, SI, SIS, or SIC)
High Speed Cable Builder - an interactive program to assist customers
in creating a valid Data Rate cable assembly part number. Found in the
High Speed Cable area of the web. (See also Build a High Speed Cable).
Hot Air Solder Leveling (H.A.S.L.) - a process of plating a printed
circuit board and typically implies a tin-lead plating on the boards.
(See also IPG)
IBIS Models (I/O Buffer Information Specification) - A mathematical
representation that presents the input/output characteristics without
revealing the actual circuit design. The EIA IBIS open forum (The IBIS
Standards Committe) has just released the first version of IBIS standards
for connectors as of Sept 12th 2003. Many software vendors are still
working with software compatibility issues. This method of modeling is
the preferred for customers who are digital design engineers. It is typically
considered a black box method of modeling versus a transmission line
and RLC type modeling used in Spice Modeling. (See also Spice Models,
SIG, SI, SIC, or SIS)
IEEE 1394 (Firewire) - First introduced as Firewire by Apple
in the late 1980s, the now approved standard was designed to support
high-bandwidth requirements of devices such as digital video equipment
and high performance mass storage.
Interconnect Processing Group (IPG) - This group has the email
address of IPG@samtec.com, and it's intent is to handle interconnect
processing questions relating to mating tolerances, connector alignment,
lead free processing, and connector re-work, processing design issues
manufacturing engineers typically encounter.
IR Reflow - A soldering process that uses infrared (IR) light
with a wavelength between visible light and microwave radiation as its
energy source. The use of infrared light is a method of heat transfer
known as radiation. (See also IPG)
IR Shadowing - A situation where connector bodies or other components
prevent the infrared energy from directly striking some solder joints
causing non-uniform heating. (See also IPG)
Impedance (expressed in ohms) - The amount of load that a system
imposes on a signal. It can also be thought of as AC Resistance. (See
also SIG, SI, SIC, or SIS)
Input/Output (IO) - In Samtec terminology, these tend to be connectors
which functions in applications from box to outside world, or outside
world to box. Many of these type of connectors have integrated panel
stops, shields for EMI protection, screw-down features, and has mating
halves which terminate to various cable halves.
Insertion Force - The force required to insert a male lead into
a female socket.
Insertion Loss (measured in decibels "dB") - The amount
of signal loss for which the connector is responsible and is mostly seen
in cable applications. (See also Attenuation, DR, SIG, SI,
SIC, or SIS)
Intermetallic - Chemical compounds formed between the metals present
in the solder, base metal, and protective platings. Intermetallic formation
is necessary for good solder joints, but excessive intermetallics can
cause brittleness.
I/O Interfaces -
Modular jacks, USB's, and high speed Cable Plug and Receptacles for
all your I/O applications.
Jitter - The jitter of a periodic signal is the delay
between the expected transition of the signal and the actual transition.
Jitter is a zero mean random variable. When worst case analysis is undertaken
the maximum value of this random variable is used.
J-Lead - A surface mount lead configuration where leads are bent
into curves. Infrequently used on interconnects. (See also IPG)
Kilohertz (KHz) - One thousand hertz. 1 hertz is the inverse unit
of time in terms of seconds. 1 Hz = 1/sec. (See also Frequency, Clock
Speed, Bandwidth, SIG, SI, SIS, or SIC)
Lan - Local Area Network
Land - The metal portion of a printed circuit board where the
leads on a surface mount component are mated. Also called a footprint
or a pad. (See also IPG)
Leaching - The movement of metal atoms from the lead base metal
into liquid solder. This is prevented by nickel plating. This may also
refer to alloying of a gold protective plating into the solder. (See
also IPG)
LGA (Land Grid Array) - An IC packaging method where the contact
points are flat plated pads arranged in a grid pattern. This is similar
to a BGA (ball grid array), but without solderballs. (See also IPG)
LIF - Low Insertion Force.
Liquid Crystal Polymer (LCP) - A plastic material commonly used
in high temperature, SMT compatible connectors.
Logic Analyzer - A device (stand alone or PC driven) that allows
system designers to collect "digital" data from the data bus
is used to determine if a system is operating correctly.
Magnetic Modular Jack - This jack will not only carry signals,
but filter as well. It can move all EMI/RFI magnetics off the PC board
into a standard-sized jack. This will allow the customer to have more
real estate on the PCBs.
Megahertz (MHz) - One million hertz. 1 hertz is the inverse unit
of time in terms of seconds: 1 Hz = 1/sec. (See also Frequency, Clock
Speed, Bandwidth, SIG, SI, SIS, or SIC)
Micro Card - Unique
low profile, high speed card-to-board interface for serial ATA™ and
other high speed daughtercard applications.
Micro Rugged - Samtec's connector family that possess robust
contacts and rugged insulator features.
MICTOR® - A Tyco acronym for "matched impedance connector".
This is a blade and beam connector with an integrated ground plane between
the two rows of signals. The single bank, 38-pin version is a standard
for test points for logic analysis.
Mini Mate® -
Interconnects designed for power applications that require up to 4
Amps of current capacity.
Mini Port™ -
Docking Port receptacle, plug and cable plugs.
Mixed Technology - Interconnect system with both through-hole and
surface mount leads that provides additional strength for high cycle,
high vibration applications.
Mutual Capacitance
- The capacitance between two conductors (one considered aggressor, the
other victim) when all other conductors are connected together and then
regarded as an ignored ground. It describes the amount of coupling due
to the electric field. The mutual capacitance will inject an often undesired
current into the victim line proportional to the rate of change of voltage
on the aggressor line. Mutual Capacitance it a cause of crosstalk.
Mutual Inductance
- The inductance between two conductors (one considered aggressor, the
other victim) placed close enough that the magnetic field induced by a
current flowing into the aggressor line encompasses the victim. The mutual
inductance will inject an often undesired voltage noise onto the victim
proportional to the rate of change of the current on the aggressor line.
Nanoseconds - billionths of a second. (See also Hz, Frequency,
Clock Speed, Bandwidth, SIG, SI, SIS, or SIC)
Near-End Cross Talk (NEXT) - the measured noise on the end closest
to the signal source.
Oxidation - The process of the surface of a metal combining with
oxygen atoms to form corrosion or tarnish. (See also ESG or IPG)
Pad - The metal portion of a printed circuit board where the leads
on a surface mount component are mated. Also called a footprint or a land.
(See also IPG)
PADS Libraries - a library of files which allows PCB designers
to import our recommended footprints and schematics into their design.
We currently only support Mentor Graphics software, and information on
this is available in the Signal Integrity area of our web site.
PC/104™ - PC/104™ is a specification that was accepted
as the “base document” for the IEEE draft standard, called
the P996.1 Standard for Compact Embedded-PC Modules.
PC/104+™ - PC/104 Plus™ is
a specification that was accepted in 1997 by the PC/104 Consortium
and establishes a standard for embedded applications with the use of
a high speed PCI bus.
PCI Express - PCI Express is an industry standard primarily
intended as a high performance serial interface targeted for use in
desktop, mobile, workstation, server, communications platforms, and
embedded devices. We have several connectors that are designed to support
serial speeds up to and greater than 2.5 Gbps, the "Baud rate" of each PCI Express
data lane. Information on this is available in the Signal Integrity, Application
Notes area of our web site.
PCMCIA - PCMCIA, which is the Personal Computer Memory Card International
Association, is a standards body founded in 1989 to encourage interchangeability
in mobile computers in which low power, ruggedness, and small size were
important.
PC99 - A specification and related hardware that are designed
to ensure optimal performance for computers. Basically, it strives to
make it easier for all hardware and software to work in a unified system.
Picoseconds - trillionths of a second. (See also Hz, Frequency,
Clock Speed, Bandwidth, SIG, SI, SIS, or SIC)
PISMO 1 - PISMO™ is the Platform Independent Storage Module Standard
that is run by an advisory council made up by Spansion, ARM, NanoAmp,
SMedia, Spreadtrum, Toshiba, Analog Devices, Broadcom, Cypress, M Systems
and Micron Technology, Inc. The goal of PISMO™ is to enable the
more rapid deployment of increasingly powerful and reasonable mobile
telecommunications, computer, and consumer products.
PISMO 2 - The PISMO2 specification
defines mechanical and electrical specifications for SFF memory modules. PISMO2’s
goal is to implement a common board level interface for memory in multimedia
devices to help standardize the field.
Pitch - The centerline spacing of the leads on an interconnect.
Plated Through-Hole - A hole through a Printed Circuit Board
that has been electroplated and into which a lead is placed and soldered
for electrical and mechanical connection. This is also commonly referred
to as PTH. (See also IPG)
Polarization - An arrangement of contacts and leads which prohibits
improper mating of plugs and sockets.
Power Buy™ -
Contact System designed for power applications up to 7 Amps of current
carrying capacity.
Power Eye™ -
Contact System designed for power applications up to 15 Amps of current
carrying capacity.
Power Mate™ -
Interconnects designed for power applications that require up to 13
Amps of current capacity.
PowerPoser® - An interposer positioned between the IC package and pcb, which takes
over almost every aspect of power delivery. Power Poser saves pcb real
estate, reduces noise, and improves FPGA or ASIC speed.
PRBS
- Pseudo-Random Bit Sequence
Press Fit - 2mm Press
Fit headers and sockets ideal for High Density applications.
Printed Circuit Board - An epoxy glass and metal composite on
which circuits are etched and to which active, passive and hardware
components are attached. This is also called a PCB or PC Board.
Propagation Delay (measured in picoseconds "pS") - The
amount of time that it takes a signal to travel between two points and
is also known as prop delay or Tpd. (See also SIG, SI, SIS, or SIC)
Q Pairs® - High
Speed Differential Pair terminals, sockets, and cable assemblies that
allow customers to route signals out-of-phase for improved electrical
performance.
Q Strip® - High
Speed terminals, sockets, and cable assemblies with controlled impedance
that can be routed either single-ended or differentially for enhanced
signal integrity.
Q2™ - Shielded
connector system provides EMI suppression ideal for High Speed applications.
Random Jitter - Jitter caused by Power Supply
noise, temperature variations and crosstalk.
Rapid I/O - RapidIO links are based on recent advances in point-to-point
interconnect technology. Designed primarily as a physical link intended
as a point-to-point interface between devices, a RapidIO lane is comprised
of a dual-simplex communications channel between two components physically
consisting of two low-voltage, differential signal pairs. We have several
connectors that are designed to support serial speeds up to and greater
than 3.125 Gb/ps, the highest "Baud rate" of each RapidIO data
lane. More information is available in the Signal Integrity, Application
Notes area of our web site.
Reflection - A process that occurs when a propagating
electromagnetic wave impinges upon a change in its supporting media properties.
In the case of an abrupt change the incident wave will "bounce"
off of the barrier in the opposite direction it came from. In other cases,
some of the wave reflects while the rest continues on.
Reflow Soldering - The process of screen printing solder paste
and then heating it to cause it to melt, or "reflow," to wet
the leads and pads around it. (See also IPG)
Return Loss - the amount of signal reflected back.
Return Path - The lowest energy path taken by the return current to the
source.
RF - stands
for Radio Frequency
RF Connectors - connectors capable of extremely high speeds (6-18
GHz) invented for use in the radio industry. Available from Samtec in
PCB terminations, cable terminations, and panel/bulkhead mount.
Ribbon-Ax® - A W.L. Gore product that is a basic ribbon cable
sandwiched with copper foil for a "near-coax" result. (See also
Coax, Twinax, SIG, SI, SIS, or SIC)
Ribbon Coax - Multiple co-ax lines that are joined or "ribbonized"
into a flat cable construction. (See also Coax, Twinax, Ribbon-ax,
DR, SIG, SI, SIS, or SIC)
Rise Time - The time that it takes for the system to switch bits
from off to on (0 to 1). (See also Frequency, SIG, SI, SIS, or SIC)
RiseUp® - Samtec's high speed connector set featuring a high
speed interface boards with embedded ground planes to mate with our edge
card connectors. RU8 Series.
RS232 (Recommended Standard) - This is a 1960 standard that was
created to interface between Data Terminal Equipment and Data Communication
Equipment. Most use a DB-25 type of connector, but many PCs today use
the DB9.
Rugged™ - High
reliability, high cycle, and high retention contacts, shrouded and
keyed insulators with positive retention features, and PCB terminations
including press fit, solder locks and mechanical hold-down options
that are ideal for high reliability applications.
SamArray® - Mating
system that provides high density, high speed, and high reliability
with standard board-to-board interconnects.
SAN
- Storage Area Network
SATA or Serial ATA - The Serialized AT Attachment Interface (Serial
ATA or SATA) is primarily intended as a low voltage, point-to-point, serialized
replacement to legacy ATA, the parallel interface used for years to connect
hard drives to CPU mother boards. We have several connectors that are
designed to support serial speeds up to and greater than 1.5 Gbps, the
"Baud rate" of each Generation 1 Serial ATA data lane. More
information on this is available in the Signal Integrity, Application
Notes section of our web site.
Score Lines - "V" shaped cuts on opposing sides of a
PCB.
This is usually an IC and supporting components that have been located
on a separate PCB from the main board. (See also IPG)
Screw Machine Contact - A high reliability contact composed of
a machine shell and a stamped or machined contact insert.
SEARAY™ - Open
Pin Field Array with lower insertion/extraction forces ideal for high
density and high speed applications.
Selective Plating - The process of selectively depositing plated
precious metals only in the contact area of a connector contact.
Self Alignment - The tendency of leads to center themselves on
solder pads due to the surface tension of the liquid solder.
SERDES -
Serializer/Deserializer, a common name for a high-speed transciever which
performs the parallel-to-serial conversion as well as the serial to parallel
conversion.
Serial ATA
(SATA) - SATA, or Serial ATA, is the process of sending information
across one wire, one data bit at a time.
Serial Port - This profile defines the procedures needed to
use Bluetooth (A low-cost, short-range wireless specification for connecting
mobile devices) for RS232 serial cable emulation.
SFP (Small
Form-factor Pluggable) Transceivers - The Small Form-Factor
Pluggable (SFP) MSA (Multi Source Agreement) is a specification for a
common interface for optical modular transceivers.
Shielding - The protective enclosure surrounding a
transmission medium, designed to minimize electromagnetic interference
(EMI/RFI).
Side Stackable - The ability to stack connectors side-to-side
on a solid grid without wasting space between connectors.
Signal Integrity (SI) - A subject relating to how well a signal
is received in a transmission line from the driver, through the trace,
through a connector and/or cable, an other trace on another board, and
to the reciever. (See also SIG, SIC, SIS, Frequency, Attenuation, Crosstalk,
Insertion Loss, Impedance Mismatch, Propagation Delay)
Signal Integrity Center (SIC) - This refers to all of the on-line
information accessible via the Samtec web site www.samtec.com/signal_integrity.
Signal Integrity Group (SIG) - This refers to all of the inside
Samtec staff of engineers and sales who support handling signal integrity
related design questions. Their email address is SIG@Samtec.com.
Single Beam Contact - A stamped contact with a flat spring that
makes contact with the lead.
Signal Integrity Services (SIS) - This refers to the additional
resources available for a fee for customers who need additional customized
signal integrity design support and services.
Single-Ended Signals - One signal per one pin in a connector.
(See also SIG, SI, SIS, or SIC)
Skew - The difference in arrival time of bits transmitted
at the same time. Bits can be elements of a parallel bus or members of
a differential pair.
Skin Effect/Loss - Electrical loss in a non-ideal medium
due to skin effect. Skin effect is the tendancy for high-frequency signal
components to travel close to the surface of the medium.
Solder Paste - A mixture of solder powder, flux, solvents, and
binder that is screen printed onto the printed circuit board and then
reflowed to form the solder joints. (See also IPG)
Solder Wicking - The flow of solder due to capillary action. (See
also IPG)
Spansion™ - Spansion™ is
the one of the world leaders in the manufacturing of NOR flash memory.
It was started in 2003 through the collaboration of AMD and Fujitsu
Flash businesses to focus on the marketing, developing, and manufacturing
of Flash memory.
SPICE Model - A complete mathematical representation of a single
transmission line or of multiple transmission lines. Models are created
from RLC and Transmission line models: RLC stands for Resistance, L for
Inductance, and C for Capacitance. A Transmission Line model consists
of a prop delay and a system impedance. (See also SIG, SI, SIS, or SIC)
Standoff - A protrusion on the bottom of a connector used to raise
it off of the printed circuit board to aid in solder fillet formation,
board inspection, flux removal, and cleaning. (See also IPG)
Stencil - Relative to electronics processing, it is a thin steel
sheet that has been tooled so that its openings match the footprint of
a PCB. Solder paste can be "screened" over it resulting in solder
paste only occupying the proper locations. (See also IPG)
Storage Combo -
These combination signal and power connectors eliminate the need for
the flat ribbon cables and power wire harnesses that are commonly used
when connecting hard drives.
Sudden Circuits® - Samtec can provide signal integrity at
any distance from 3mm to 3m with High Speed Connectors, Riser Cards,
High Speed Flex Circuit Assemblies, and Data Rate Cable Assemblies.
Surface Mount (SMT) - The process of assembling printed circuit
boards with components soldered to the surface rather than to plate through
holes. (See also IPG)
Tiger
Beam™ - Post
and Beam Contact System with reliable performance and consisdered the
best cost of all Samtec contacts.
Tiger Buy - Tuning
Fork Contact System with high mating and unmating retention and cost
effective.
Tiger Claw™ - Dual
Wipe Contact System ideal for pass-through applications and ultra low
profile.
Tiger Eye
Lite™ -
Multi-Finger Contact System ideal high reliability applications.
Tiger Eye™ - Multi-Finger
Contact System ideal for high reliability and high mating cycle applications.
Tiger-Eye-IDC - Multi-Finger
IDC Cable Contact System ideal for high reliability and high mating
cycle applications.
Time Domain Reflectometry (TDR) - is the domain in which
high speed digital products perform. Two important properties are
clock period and rise time.
Twinax - Two center conductors which may be either stranded
or solid, surrounded by a dielectric, surrounded by an outer conductor
otherwise commonly known as ground, enclosed in an outer jacket.
Samtec often utilizes ribbonized designs of twinax to terminate
to high speed connectors for use in differential or differential
pair applications. (See also Coax).
Ultra High Frequency (UHF) - a term used for the radio industry
Universal Serial Bus (USB) - The USB standard was designed to provide
a common interface between a PC and its peripherals.
Universal Serial Bus On the Go (USB OTG) - As portable devices,
such as MP3, digital cameras, PDAs and mobile phones, increase in popularity,
there is a growing need for them to communicate directly with one another.
The USB OTG addresses this need by allowing a USB peripheral to have
the following enhancements: limited host capability to communicate with
selected other USB peripherals, a small USB connector to fit the mobile
form factor, and a low power feature to save battery life.
Vapor Phase Soldering - A soldering process that uses the latent
heat of vaporization of a liquid as its energy source. (See also IPG)
VITA 42 -
XMC, known as the Switched Mezzanine Card, was created by
VITA 42 and was designed to meet the requirements of high performance
systems in rugged environments.
Vport™ - Differential
Pair Signal Routing I/O cable assemblies and receptacles designed for
High Speed applications.
WAN
- Wide Area Network
Wave Soldering - The most widely used mass soldering process, primarily
for through-hole boards, where the board is passed over a wave of solder
which laps against the bottom of the board to wet the metal surfaces to
be joined. (See also IPG)
Wetting - The ability of liquid solder to attach itself to the
surfaces being joined through the formation of the intermetallic bonds.
(See also IPG)
Withdrawal Force - Force required to remove a lead from a contact,
generally considered to be 1/2 ounce minimum.
XAUI - The 10 Gigabit Attachment Unit Interface (XAUI ) is primarily
intended as a point-to-point interface of up to approximately 50 cm (19.685
inches) between integrated circuits using controlled impedance traces
on low-cost printed circuit boards (PCBs). Samtec has developed a full
line of connector products that are designed to support serial speeds
up to and greater than 3.125 Gb/ps, the "Baud rate" of each
XAUI data lane. More information on this is available in the Signal Integrity,
Application Notes section of our web site.
XENPAK MSA - XENPAK MSA is
the next step beyond the XFP MSA. XENPAK
and XFP are very similar, but there are a few key differences. XENPAK
uses a larger connector, which results in lower density on the linecard,
but compensates for the power dissipation that is associated with long
runs and Gigabit Ethernet speeds.
XFP -
The XFP MSA is the next version of the SFP specification, which designed
a new generation of optical modular transceivers.
Z Beam® - Solderless
Contact System ideal for high density and low profile applications.
ZIF - Zero Insertion Force.
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