Service Center Login
HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
ACTIVE OPTICS
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Service Center
Board-to-Board
High Speed Connectors
High Speed Cable
Cable Jumper
RF Interfaces
 I/O
 Discrete Wire
Sealed Rectangular 		Sealed Circular
Edge Card
Test and Debug 
Optical
Last updated December 2011  
Back to Menu  
High Speed Cable
  
HDLSP
- High Speed Cable Assembly to Hypertransport Standard
Estimated Release Date - 1st Quarter 2012
Estimated Samples - 1st Quarter 2012
Mates with:  HDI6
  Top
ECDP
- .8mm (.0315") Ultra Low Cost, Edge Card, Twin Ax Cable Assembly
Estimated Release Date - 1st Quarter 2012
Estimated Samples - 1st Quarter 2012
See also: EEDP
Mates with: HSEC8-DV, HSEC8-EM, HSEC8-RA
  Top
   
Contact Us  |   About Us  |   Jobs  |   Environmental Compliances  |   Help  |   Recent News  |   New Products
           
Copyright © Samtec, Inc