 Altera®
HSMC
(High Speed - Mezzanine Card)
The
Altera® HSMC defines electrical and mechanical properties of a high
speed mezzanine card interface. This specification standardizes the way
in which mezzanine cards communicate and connect to host boards. By taking
advantage of the high- performance I/O features found in today’s
FPGA devices, manufacturers can build a single mezzanine card that will
then interface to multiple host boards. Similarly, they can build a host
board that can leverage many different, pre-built, mezzanine cards.
The HSMC connectors
defined by the specification are based on the 0.5mm pitch Q Strip®
QSH/QTH series high speed board-to-board connectors from Samtec. The host
board connector is Samtec part number ASP-122953-01 (a modified QSH series).
The mezzanine card connector is Samtec part number ASP-122952-01 (a modified
QTH series). These ASP connectors are partitioned into three “banks.”
Bank 1 in each respective connector has every third signal pin removed
to allow for multi-gigahertz differential signaling. Bank 2 and Bank 3
in each respective connector have the entire rows of signal pins filled
for various single-ended interface signals. Contact Joel Seelyat jseely@altera.com
to request the HSMC specification for recommended intentions for running
both high-frequency and low speed interface signals within the various
“banks."
The HSMC connectors
can be purchased from Samtec by any customer to use in their own proprietary
hardware design. Contact Pricing
to request a quotation for these connectors:
Altera®
Development Kits
Several Altera® development kits already feature host boards with
the HSMC connectors. These host boards are often used by FPGA designers
for prototyping their hardware designs. The benefit to customers is two-fold.
First, a variety of mezzanine cards are being created by Altera® and
other hardware providers. Second, customers can create their own HSMC
solutions and then interface those custom mezzanine cards to several different
FPGA host boards.
The Stratix® III FPGA Development Kit
The Stratix® III FPGA Development Kit delivers a complete environment for the development and testing of designs requiring high performance and high density devices.
 Stratix III FPGAs combine the world's highest performance and highest density with the lowest possible power consumption. You'll find Stratix III FPGAs provide the high-performance and high-integration capabilities needed for next-generation basestations, network infrastructure, and advanced imaging equipment.
Two of the HSMC socket connectors
ASP-122953-01 are present on the Altera Stratix® III FPGA Development Kit. ASP-122952-01 is the HSMC header connector which mates with the socket. These connectors can be purchased from Samtec by any customer to use in their own proprietary hardware design.
Contact Pricing at Samtec to request a quotation for these connectors.
To order The Stratix® III FPGA Development Kit from Altera go to: http://www.altera.com/products/devkits/altera/kit-siii-host.html
PCI Express Development Kit, Stratix II GX Edition
Altera's PCI Express Development Kit, Stratix® II GX Edition delivers a complete PCI Express-based development platform. This PCI Express solution, interoperable with industry-standard PCI Express platforms, facilitates the development of custom PCI Express applications. The board also enables system-level solutions by operating as a stand-alone development platform allowing for a variety of custom applications running on the Stratix II GX FPGA. The development kit complies with the European Restriction of Hazardous Substances (RoHS) directives.
 Two of the HSMC socket connectors ASP-122953-01 are present on the Altera PCI Express Development Kit, Stratix® II GX Edition. ASP-122952-01 is the HSMC header connector which mates with the socket. These connectors can be purchased from Samtec by any customer to use in their own proprietary hardware design.
Contact Pricing at Samtec to request a quotation for these connectors.
To order The PCI Express Development Kit, Stratix II GX Edition from Altera go to: http://www.altera.com/products/devkits/altera/kit-pciexpress_s2gx.html
Terasic DE3 System, Stratix III Edition
Terasic DE3 System is designed for all FPGA development and ASIC prototyping, which includes HW/SW co-development, proof-of-concept studies, IP development, algorithm verification, scientific research, hardware acceleration, and product evaluations. Each DE3 board can be equipped with Stratix III 150, 260, or 340 device according to users' needs.
Many ASIC design companies and top universities in the world have chosen Terasic DE3 system as their main ASIC prototyping platform.
Two of the HSMC socket connectors ASP-122953-01 are present on the Terasic DE3 System, STratis III Kit. ASP-122952-01 is the HSMC header connector which mates with the socket. These connectors can be purchased from Samtec by any customer to use in their own proprietary hardware design.
Contact Pricing at Samtec to request a quotation for these connectors.
Click
here for a listing of all Altera® development kits available.
Final Inch®
PCB Design Tools
Break
Out Region (BOR) PCB designs that save design, development and validation
time and resources and predict real-world performance expectations in
real world signal integrity applications.
High Speed
Cable Solutions
Samtec offers a few standard lengths of High Data Rate cables for customer
hardware applications, which use the HSMC connectors and need a high speed
cable. Contact the HDR Group
for technical information and the Pricing
Group to request a quotation.
Samtec also offers
a high speed coax SMA breakout cable for observation of the differential
signal channels on a test instrument. Contact the HDR
Group for technical information and the Pricing
Group to request a quotation.
General Information
For more information contact Altera® at http://www.altera.com
For more information
about the HSMC connectors (Samtec ASP’s), or information related
to high speed cable solutions, please contact Samtec’s Reference
Design Group. |