Final Inch^® Electrical Models

With Final Inch® , Samtec extends the SPICE model concept beyond the connector further out onto the board. SPICE models of the breakout region and traces are provided so that the electrical effects of the entire Final Inch® design can be easily simulated. Samtec HSPICE models include:

• Connector
• Vias
• Footprint
• Trace Fanouts

Models of the optimized trace designs are length scalable. Models are also available for various stack heights within a connector family. The connector and breakout region models can be used in most SPICE-based simulation tools. The optimized trace design models can only be used in HSPICE.

For more information or questions about Final Inch®, email the Samtec Final Inch® Group or submit our Final Inch® Request Form.

NOTE: Samtec Final Inch® models are Intellectual Property protected by US and International copyrights. These designs and data are licensed for unlimited, free use by Samtec customers under certain conditions.

Click here to view a read-only copy of the terms and conditions of each applicable license agreement.