Click here to go directly to the Final Inch® Information Request Form.
Final Inch® Overview Typical PCB transmission line structures have been studied in depth over the years, and their application is common knowledge in the signal integrity arena.
Typically, connectors require solder thru holes or surface mount pads for attachment to the board. Also, most signal traces are routed on internal board layers. Thus, vias are often required in the break out region in order to establish connection between the connector pins and the signal traces. These vias can add significantly to the routing headaches.
One of our over-riding goals at Samtec is to try to achieve the highest level of “ease of use” of our connectors. We want to make our connectors the absolute, easiest connectors to design in to a system. As part of this effort, we wanted to take the PCB recommended BOR design concept to a higher level.
Click here to see a typical PCB design flow. Click here to see PCB design flow when using Samtec's Final Inch® BOR.
Samtec has designed and developed Final Inch® - a BOR design that is optimized for ease of PCB manufacture AND for high speed performance. And we are going several steps further.
Electrical Models Second, we are providing SPICE models of this board section and the associated connector/s. These will be downloadable as well in HSPICE and can be cut and pasted into the standard SI simulation packages. PSpice is available for the connector and BOR only. You therefore can simulate the electrical performance of this entire, critical region and study its impact in your proposed system.
Empirical Signal Integrity Data Finally, Final Inch® is not complete without validation of the electrical system performance through signal integrity modeling, simulations and measurements. Samtec will supply simulation and test reports to support our Final Inch® Designs.
Samtec is now offering "on request" test data including eye patterns for our Final Inch® circuits using our new Agilent PLTS 50 GHz Characterization System. For more information on this new service, click here.
Click here to view Samtec's Comparison of Eye Patterns Generated by Synopsis HSPICE and the Agilent PLTS white paper. This document shows that there is good correlation between Samtec's Final Inch® HSPICE simulated eye patterns to eye patterns processed from S-parameter data measured with Samtec's new Agilent PLTS 50 GHz High Speed Characterization System. Samtec QPairs® QTE-DP/QSE-DP Final Inch® simulations were used as the test article.
Additionally, we can provide assistance through our Signal Integrity Services Group to customers who wish to utilized the design in some way other than our standard configurations.
Final Inch® physical art and electrical models are available for all of the series below:
Please note that a license agreement will be required to receive each form of Final Inch® Information you request. Click here to view a read-only copy of the terms and conditions of each applicable license agreement.
For questions on Final Inch®, contact our Final Inch® Group. Click here to review the July 17th article in EE Times featuring Samtec Final Inch®.
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