The Final Inch® is not complete without validation of the electrical system performance through signal integrity modeling, simulations, and measurements.

Advanced 2D and 3D modeling methods are used to provide accurate models for all sections of the Final Inch® boards. Test boards have been manufactured and characterized through measurements and then correlated to simulations.

These measurements are then compared to original simulation results for correlation and modeling process improvement. Some VNA measurements are converted to HSPICE models utilizing Sigrity BroadBand Spice, simulated in the frequency and time domain, and compared to the original simulation models. These comparisons are fed back into the modeling process to correct for PCB trace loss characteristics and provide process improvements.

Samtec is now offering "on request" test data including eye patterns for our Final Inch® circuits using our new Agilent PLTS 50 GHz Characterization System. For more information on this new service, click here.

Click here to view Samtec's Comparison of Eye Patterns Generated by Synopsis HSPICE and the Agilent PLTS white paper. This document shows that there is good correlation between Samtec's Final Inch® HSPICE simulated eye patterns to eye patterns processed from S-parameter data measured with Samtec's new Agilent PLTS 50 GHz High Speed Characterization System. Samtec QPairs® QTE-DP/QSE-DP Final Inch® simulations were used as the test article.

Click on the link below to view the Empirical Signal Integrity Data that you require:

Applies to All Mounting Configurations

RF Connector Channel Properties Simulation Study

High Speed Characterization Report