Login to your Samtec Service Center
  Go SIGNAL INTEGRITY SERVICES - Signal Integrity Literature
Advanced Searches

DESIGN GUIDES
eBROCHURES
Transmission Line Solutions Guide
Signal Integrity Handbook

Semiconductor Design Guide

Arrays
SEARAY™

HD Mezz
DP Array™

Mezzanine
Stackable Embedded Systems
Q2™Shielded Connector System
Q Strip®/Q Pairs® Vertical
RF Connectors
RiseUp®

Edge Rate
Edge Rate Emulation

The Edge is Near

Right Angle/Edge Mount
Micro Backplane
Q Strip®/Q Pairs®
-High Speed Right Angle

Q Strip®/Q Pairs®
-Edge-Mount

High Speed Cable
Spirit™ Probe
Data Rate Cable Assemblies
AccliMate™
Custom RF Cable
Mini Edge Card & Flex
Edge Rate Emulation

DESIGN GUIDES

Transmission Line Solutions Guide - The "Path of Least Resistance" for creating a transmission line or transferring an electronic signal from one point to another when Signal Integrity, EMI, Pin Mapping, Rugged Environments, or Power Requirements present a design challenge.

Click here to download the PDF version


Signal Integrity Handbook

This handbook is designed as a reference for those with little or no signal integrity experience who are tasked with selecting a high speed interconnect.  It will help enable you make an informed decision when specifying components that will affect the signal integrity of your system.

Download PDF Version

Semiconductor Design Guide - Designed with the semiconductor and test equipment industry in mind, Samtec's Interconnect Solutions for Semiconductor Designs brochure shows the engineer and test vendor how to decrease design cost and time using Samtec's design support tools and how we can meet or exceed their transmission line requirements at multi-Gigabit speeds.

Download PDF Version

eBROCHURES
ARRAYS

SEARAY™ Robust High Speed, High Density Interconnects

Right angle option for perpendicular and backplane applications

Download PDF Version


HD Mezz* High Density Array System

Elevated high speed, open pin field on 1.2mm grid, intermateable with Molex Incorporated

Download PDF Version
*HD Mezz is a trademark of Molex Incorporated.


DP Array™ High Speed Connector Systems

DP layout and perimeter grounds simplify routing and require fewer PCB layers

Download PDF Version


• MEZZANINES

Stackable Embedded Systems

Meets embedded Industry Standards

View On-Line


Q2 Shielded Connector System

For High Speed and Micro Rugged Applications

Download PDF Version


Q Strips®/Q Pairs® High Speed Vertical Mezzanine Connectors

For Parallel Board-to-Board Applications

Download PDF Version


Custom Combination RF Connectors and Cables

Unique Cable Assemblies and Connector Systems

Download PDF Version



RiseUp® Elevated Connector Set

High Speed and Elevated Stacking

Download PDF Version


EDGE RATE



Edge Rate Emulation Family Flyer
Check out these board level cable and connector assemblies.

Download PDF Version


The Edge is Near
Learn how Samtec's Edge Rate contact is designed for High Speed applications.

Download PDF Version


•  Right Angle/Edge Mount

Micro Backplane
Many Samtec board level interconnects can be configured for a "Micro backplane" application.  Find out more!

Download PDF Version


Q Strips®/Q Pairs® High Speed Right Angle Mezzanine Connectors

For Perpendicular and Coplanar Applications

Download PDF Version


Q Strips®/Q Pairs® High Speed Edge-Mount Mezzanine Connectors

For Edge-Mount and Coplanar Applications

Download PDF Version


• HIGH SPEED CABLE

Spirit™ Connectorless Probing Flyer
Learn about Samtec's line of Spirit™ Products.

Download PDF Version


Data Rate™ Cable Assemblies

For High Speed Systems

Download PDF Version


Samtec AccliMate™ Sealed Circulars and Cable Assemblies

Dust and water proof for rugged environments

Download PDF Version


Cool Custom Combination RF Connectors and Cables

Unique Cable Assemblies and Connector Systems

View On-Line


Mini Edge Card and Flex Circuit Data Links

High Density Cable-to-Board Applications

View On-Line


Edge Rate Emulation Family Flyer
Check out these board level cable and connector assemblies.

Download PDF Version