Our new process is based on the use of high frequency microprobes. Connectors are soldered to small printed circuit boards (PCBs), using standard, Samtec recommended pad footprints. Very short, controlled impedance traces are routed from the pads to electrically optimized probe launch points. The effects of the pads and traces are included in the measurement. These effects result in slightly conservative loss numbers, but the total effect is very similar to what can be expected in a real application.

The new method should not be confused with Samtec’s Final Inch®. Final Inch® takes the characterization process a bit further. In Final Inch®, a complete PCB break out region is designed and optimized for both high speed electrical performance and cost effective manufacturability. Final Inch® includes electrical effects of the entire break out region. Some effects of concern include via field coupling, via stub resonance, and long trace coupling and losses. Such effects are very minimal or non-existent in our connector characterization process. Click here for more information on Final Inch® or contact our Final Inch Group.

We are currently characterizing many of our high speed connectors using this new process. During this transition period, some characterization reports based on different test methods will still be available. Please read the reports carefully to note these differences, and be aware that comparing data between old and new reports might not lead to valid "apple to apple" comparisons. Click here for more information on Samtec’s new Speed Rating based on the -3 dB insertion loss point of the connector system.