 Samtec
High Speed Interconnect Solutions
and Xilinx Development Platforms
Xilinx®,
together with Distributors and Third Party Partners, offers a complete
line of development and expansion boards to help customers test and develop
designs using Xilinx devices over a wide range of applications.
The
following Xilinx Development Platforms are designed to aid in the development
and evaluation of customer application boards which use the Virtex-5 LXT
FPGA family.
 Xilinx has selected Samtec’s .8mm Q Pairs® Series connectors as the High
Speed interface on new Virtex™- 5 Development Boards. These
Samtec High Speed connectors and optional Data Rate cables can be purchased
directlyfrom Samtec by any customer to use in their own proprietary hardware
design.
Virtex-5 ML550 Networking Interface Development Platform
 The
Xilinx ML550 Platform is ideal for development and evaluation of networking
and source synchronous interfaces using the Virtex™ -5 LXT FPGA family.
It is also the preferred platform for analyzing and demonstrating the
power consumption characteristics of Virtex-5 devices. It utilizes six
Samtec Q Pairs® connectors for high speed interface in Mother/Daughter
card applications. The Q Pairs® connectors transmit Low Voltage Differential
Signaling (LVDS) and enable high speed management of Xilinx MultiGigabit
Transceivers. For
more information of the Xilinx ML-550 platform, go to: http://www.xilinx.com/ML550
Virtex-5 ML555 LXT Development Platform
The Virtex™-5
LXT FPGA Development Kit for PCI-Express® supports PCIe®/PCI-X™/PCI™.
This complete Development Kit passed PCI-SIG compliance for PCI Express
v1.1 and enables you to rapidly create and evaluate designs using PCI
Express, PCI-X and PCI interfaces. It utilizes two Samtec QSE-DP Q Pairs®
connectors for PCI and PCI Express applications. Samtec’s QSE-DP Series
connectors allow for mezzanine expansion card support.
For
more information of the Xilinx ML555, go to: http://www.xilinx.com/Ml555.
Samtec connectors
on Virtex-5 ML550 & ML555
LXT Development Platforms
Both platforms feature
multiple Samtec .8mm Q Pairs® sockets. The ML550 uses six
QSE-028-01-L-DP parts per board. The ML555 uses two QSE-028-01-L-DP parts
per board.
http://www.samtec.com/technical_specifications/overview.aspx?series=QSE-DP
The
QSE-DP Series mates with Samtec’s .8mm Q Pairs® header QTE-028-XX-L-DP.
Note that selecting the -01 Lead Style (in place of –XX) will achieve
a 5mm stack height when mated with the QSE-DP. Contact Samtec for Application
Specific Option stack heights to achieve 8mm, 11mm, 14mm, 16mm, 19mm,
22mm, 25mm, and 30mm stacks.
http://www.samtec.com/technical_specifications/overview.aspx?series=QTE-DP
Final Inch® PCB Design Tools
Samtec
Signal Integrity engineers have developed Final Inch® Break Out Region
(BOR) PCB tracerouting recommendations for many of our most popular high
speed connector series including QTE-DP/QSE-DP Series selected by Xilinx
on their new V-5 Development Platforms. These no-charge design tools
save you design, development, and validation time. Final Inch® PCB Design
Tools predict real-world performance expectations in real world signal
integrity applications.
For more information
on any Samtec High Speed Connectors, Cables, or Reference Designs, please
contact Samtec’s Reference
Design Group.
High Speed Cable
Solutions
Samtec offers .8mm Data
Rate cables to mate with Samtec Q Pairs® in hardware applications which
need to connect boards at extended distances up to 1m. To build a Data
Rate Cable Assembly using Samtec’s High Speed Cable Builder, please link
to our online Cable Builder here.
Contact our HDR Department for technical information and our Pricing Department to request a quotation.
Samtec also offers a
High Speed coax SMA breakout cable, our EQRF Series, for observation of
the Differential Signal channels on a test instrument. http://www.samtec.com/technical_specifications/overview.aspx?series=EQRF
Contact our HDR Department for technical information and our Pricing Department to request a quotation.
EXP Expansion Connector Specification by Avnet Electronics
 
The
EXP Specification defines a versatile expansion interface to FPGA baseboards, allowing designers
to add application specific daughter cards and easily connect to the FPGA
I/Os. It is a royalty free, public domain
specification developed exclusively for the unique requirements
of FPGA development boards. The EXP specification defines Samtec’s Q Strip®
QTE-060-XX-F-D-A for use on the customer baseboard (where –XX can vary
to denote the desired board-to-board height of 5mm, 8mm, 11mm, 16mm, 22mm,
or 25mm when mated with QSE-060-01-F-D-A).
http://samtec.com/technical_specifications/overview.aspx?series=QTE
http://samtec.com/technical_specifications/overview.aspx?series=QSE EXP
Modules and Evaluation Kits by Avnet Electronics
Avnet Electronics has
also developed an assortment of EXP modules to add application-specific
features to EXP-enabled baseboards. The EXP modules and The Virtex-5 Evaluation
Kits feature the same Samtec Q Strip® parts defined by the EXP Specification.
 The Xilinx Virtex-5 LX Evaluation Kit
The Xilinx Virtex-5 LX Evaluation Kit by Avnet provides a complete development platform for designing and verifying
applications based on the Xilinx Virtex-5 LX FPGA family. Available with
the Virtex-5 LX50 or LX110, the kit enables designers to prototype
high-performance designs with ease, while providing expandability and
customization through the EXP expansion slot.
The
Xilinx Virtex-5 LXT/SXT PCI Express Development Kit
provides a complete development platform for designing and verifying applications
based on the Xilinx Virtex-5 LXT and SXT FPGA families. Available with
the Virtex-5 LXT or SXT, the kit enables designers to prototype high-performance,
multi-gigabit serial transceiver based designs with ease, while providing
expandability and customization through the EXP expansion slot.
For more information on
the Avnet’s EXP Specification, and all Avnet designed
EXP Modules and Evaluation Kits go to: www.em.avnet.com/exp.
Virtex-5 PCI Express Development Boards 
by HiTech Global Distribution
The HTG-V5-PCIE boards
are powered by Xilinx Virtex™-5 LX50T, LX110T , LX330T, or SX95T with
12 ~ 24 RocketIO™ GTP Transceivers, four hard-coded Gigabit Ethernet
Media Access Controllers (MAC), one PCI Express End-Point Block, and up
to 331,000 Logic Cells.
 The
HTG-V5-PCIE boards
provide a wide variety of connectors and interfaces including: one PCI
Express 8-lane upstream, two Gigabit Ethernet (10/100/1000, one with SGMII
support), eight Samtec SMAs (connected to two RocketIO GTP
channels), two Samtec QSE-060-01-L-D-A
Q Strip® connectors providing for 64 pairs of LVDS (for DVI Tx, USB 2.0,
Cameralink, and I/O modules), and two Samtec QSE-020-01-L-D-A connectors
providing access to 10 RocketIO GTP transceivers (up to 3.125 Gbps).
http://samtec.com/technical_specifications/overview.aspx?series=QTE
http://samtec.com/technical_specifications/overview.aspx?series=QSE
http://www.samtec.com/signal_integrity/technical_specifications/catalog.asp?series=SMA-TH&menu=SIGNAL_INTEGRITY
http://samtec.com/technical_specifications/overview.aspx?series=RF316
For
more information on HiTech Global’s Virtex-5
PCI Express Development Board, go to: http://www.hitechglobal.com/Boards/PCIExpressLX330T.htm
http://www.hitechglobal.com/Boards/V5PCIExpress.htm
http://www.xilinx.com/products/devkits/HW-V5-PCIE2-UNI-G.htm
Resources and Expertise
from Xilinx Industry Partners
As part of the Xilinx
XtremeDSP™ Initiative, Xilinx works with their distributors and many OEMs
to provide a variety of DSP prototyping and development platforms. This
approach complements their extensive FPGA, software tools, and IP offerings
to further accelerate, customize, and improve DSP system designs.
For more
information on Third Party DSP Development Boards and Kits go to: http://www.xilinx.com/technology/dsp/thirdparty_devboards.htm
Xilinx RocketLabs
The Xilinx RocketLabs
give customers free access to Advanced Design and Characterization Equipment.
RocketLab locations are fully equipped with high speed serial test and
measurement equipment from Agilent and a wide variety of Xilinx and partner
Development Boards supporting up to 10 Gbps designs. The labs also include
software and development tools such as Samtec’s Final Inch® to support
customer designs.
There are 15 RocketLabs locations worldwide for customers to access:
Boston,
Chicago,
Dallas,
Raleigh,
Ottawa,
San Jose,
London,
Paris,
Munich,
Stockholm,
Milan, Tel Aviv, Shenzhen,
Seoul, and
Tokyo.
For more information
on how to evaluate, validate, or debug design at any Xilinx RocketLabs
location, visit http://www.xilinx.com/prs_rls/silicon_vir/03153rocketlabs.htm.
Xilinx Articles, Test Reports,
and Presentations
related to Samtec High Speed Interconnect Solutions
Universal
LVDS Ribbon Cable
Virtex-4
Source-Synchronous Interfaces Tool Kit
Selecting
Connectors for Multi-Gigabit Transceiver Designs
RocketIO
MGTs with High Speed Samtec Connectors and Cable Assemblies
Technical Support and General
Information
For Signal
Integrity support related to implementation of Samtec High Speed connectors
and cable, contact our Signal Integrity Group.
For General Information,
contact Samtec at http://www.samtec.com or Xilinx® at http://www.xilinx.com. |