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Signal Integrity Services
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Final Inch®
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Samtec "Final Inch®" is the design of the break out region (BOR) on
a printed circuit board (PCB). In this region, signals coming from the connector
pins are connected to traces on the PCB. Generally, from the BOR, the traces can
be designed as standard transmission line structures for signal distribution across
the PCB.
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Final Inch® physical art and electrical models are available for all of the series
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They are separated into different pin out variations/mounting configurations. For
more information on these pin out configurations/mounting configurations or to request
the actual physical design files, electrical models, empirical data, or test and
evaluation boards, click on the product series from the list below:
Select Series
Click here to go directly to the Final Inch®
Information Request Form.
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Final Inch® Overview
Typical PCB transmission line structures have been studied in depth over the years,
and their application is common knowledge in the signal integrity arena.
 Sophisticated auto routing software has been developed
to aid in designing the routing of the transmission lines. However, designing the
transitional area between the connector and the transmission line traces is an area
wrought with design headaches. Currently, a large portion of the BOR design can
not be automated, so a significant portion of the total PCB design process is focused
on this area.
Typically, connectors require solder thru holes or surface mount pads for attachment
to the board. Also, most signal traces are routed on internal board layers. Thus,
vias are often required in the break out region in order to establish connection
between the connector pins and the signal traces. These vias can add significantly
to the routing headaches.
One of our over-riding goals at Samtec is to try to achieve the highest level of
"ease of use" of our connectors. We want to make our connectors the absolute, easiest
connectors to design in to a system. As part of this effort, we wanted to take the
PCB recommended BOR design concept to a higher level.
Click here to see a typical
PCB design flow.
Click here to see PCB design flow when using
Samtec's Final Inch® BOR.
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Samtec has designed and developed Final Inch® - a BOR design that is optimized
for ease of PCB manufacture AND for high speed performance. And we are going several
steps further.
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Physical Models
First, we are offering this design as a downloadable file in Gerber and .dxf formats,
for cut and paste application into standard board layout software packages. The
entire design will be treated as a component that you can drop into your software
and route to and from.
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Electrical Models
Second, we are providing SPICE models of this board section and the associated connector/s.
These will be downloadable as well in HSPICE and can be cut and pasted into the
standard SI simulation packages. PSpice is available for the connector and BOR only.
You therefore can simulate the electrical performance of this entire, critical region
and study its impact in your proposed system.
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Test and Evaluation Boards
Third, we have test and evaluation boards based on these designs. These boards contain
the actual BOR design and attached lengths of controlled impedance and matched length
transmission lines. These lines will terminate into industry standard coaxial connectors,
which will provide easy connection to lab instruments. We are also providing probe
points on the boards so that industry standard micro probes can be used since some
customers prefer to use probes over SMA's. You can use these boards to evaluate
the connectors' performance in your own laboratory using whatever signaling schemes
you prefer.
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Empirical Signal Integrity Data
Finally, Final Inch® is not complete without validation of the electrical system
performance through signal integrity modeling, simulations and measurements. Samtec
will supply simulation and test reports to support our Final Inch® Designs.
Samtec is now offering "on request" test data including eye patterns for our Final
Inch® circuits using our new Agilent PLTS 50 GHz Characterization System. For
more information on this new service, click
here.
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Click here to view
Samtec's Comparison of Eye Patterns Generated by Synopsis HSPICE and the Agilent
PLTS white paper. This document shows that there is good correlation between
Samtec's Final Inch® HSPICE simulated eye patterns to eye patterns processed
from S-parameter data measured with Samtec's new Agilent PLTS 50 GHz High Speed
Characterization System. Samtec QPairs® QTE-DP/QSE-DP Final Inch® simulations
were used as the test article.
Additionally, we can provide assistance through our Signal Integrity Services Group
to customers who wish to utilized the design in some way other than our standard
configurations.
Final Inch® physical art and electrical models are available for all of the
series below:
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- QTE/QSE - Q Series™ (.8mm)
- QTH/QSH - Q Series™ (.5mm)
- DPAM/DPAF - DP Array™ (2,16mm)
- YFS/YFT/YFW - (.050")
- QMS/QFS - Q2™ (.635mm)
- QTS-RA/QSS - Q Series™(.635mm)
- SEAM/SEAF - SEARAY™ (.050")
- BNC7T - 75 Ohm BNC Jack
- ST4/SS4 - Micro High Speed Interfaces
- SEAM/SEAF-RA - SEARAY™ (.050")
- LPAM/LPAF - Low Profile Array™ (.050")
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- MMCX - RF Connectors
- RU8 - Rise Up® (.8mm)
- PCIE - PCI Express Connectors
- HDAM/HDAF - HD Mezz (1,2mm)
- HSEC8 - (.8mm) Edge Card Connectors
- GCAM/GCCA - Databank™
- ERM8/ERF8 - (.8mm) Edge Rate
- MODS-LJ - (LifeJack™)
- QRM8/QRF8 - Q Rate® (.8mm)
- ERM5/ERF5 - (.5mm) Edge Rate™
- IJ5/IP5 - (4mm) 50Ω IsoRate™
- MCX - RF Connectors
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They are separated into different pin out variations/mounting configurations. For
more information on these pin out configurations/mounting configurations or to request
the actual physical design files, electrical models, empirical data, or test and
evaluation boards, click on the product series from the list below:
Select Series
Please note that a license agreement will be required to receive each form of Final
Inch® Information you request.
Click here
to view a read-only copy of the terms and conditions of each applicable license
agreement.
For questions on Final Inch®, contact our
Final Inch® Group.
Click here to review
the July 17th article in EE Times featuring Samtec Final
Inch®.
* HD Mezz is a trademark of Molex Incorporated.
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