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SPICE / IBIS Models

Select the standard Samtec series you wish to view and click the button to the right.

Simulations are available in Single Line and Multi Line version and can be supplied as:

HSPICE(.sp)
PSPICE(.cir)
Cadence SPECTRAQest(.dml)
Mentor IXC(.mmf)
IBIS V.32 or S-Parameter(touchstone)

Samtec's Testing and Modeling Capabilities use a variety of test equipment and software. Click here to view Samtec's High Speed Test Equipment and Software List.

Our IBIS-like models are available in either a Cadence SPECCTRAQuest (.dml) or Mentor ICX (.mmf) format. For additional information on employing connector models in Cadence SPECCTRAQuest, click here. The IBIS Interconnect Modeling Specification (IBIS ICM 1.0) was approved on September 12, 2003 (www.eda.org/pub/ibis/connector/), and Samtec plans on working towards providing true IBIS models now that the IBIS ICM specification has been approved. Since these models will be in direct accordance with this specification, they can not be imported into simulation packages until software vendors support the IBIS ICM spec.

Attention Agilent ADS Users – Samtec ADS Design Kit Installation Instructions
1. Unzip the folder entitled ADS_XXX_XXX downloaded from Samtec.com (XXX_XXX = the name of the downloaded mated product series)
2. Unzip the folder entitled XXX_XXX_networks
3. Save the contents of the networks folder from the extracted file to the networks folder of the ADS project in which they will be employed
4. Install the ADS_XXX_XXX folder as a design kit within ADS
5. Contact SIG with any questions/problems encountered

Attention Hyperlynx Users – Samtec can provide single-line and multi-line models for use with ELDO. If your version of HyperLynx does not include ELDO, we may still be able to help you. Please contact the Signal Integrity Group, or use our on-line electrical models request form.

Attention Cadence SigXplorer Users -- Cadence has developed an Application Note entitled "Modeling Connectors in ESPICE Format for Use in SigXplorer". The purpose of this Application Note is to describe how you can use single line and multi line SPICE models to model connectors for circuit analysis in SigXplorer. The document can be found here AppNote_espice_conns.pdf. Samtec's connector models are already available in the Cadence ESPICE format (DML file extension).

Click here to view Samtec's EQCD High Data Rate Cable Assembly SPICE Model Validation Report white paper.
Click here to view Samtec's HFEM-SE High Data Rate Cable Assembly SPICE Model Validation Report white paper

If you do not find the Samtec product series that you need in the list above, please contact our Signal Integrity Group to request a new model. Someone from our Signal Integrity Group will be in touch with you to discuss the details.

ACD, ASP, CEP, CIP, HDR, IM, LF0100, LF0150, MEP, OTP, PCBA, REF, RSP, SCF, SEP, SME, SUB-ASP, TCD Series - Information is not available here for Application Specific Products. Contact eASP for any information on this series of connectors. To create a new Application Specific Product, please visit our Custom Products Section.

For information on our ASP connectors used in Agilent Logic Analyzer and other Test Probes and Debug Devices, Vita 42 XMC/RapidIO, Micro High Frequency, Nokia M2M, Altera, and PC/104 Express applications, please visit our Highlight ASP area.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.