Service Center Login
Catalog
  |   Prints   |   Search   |   Samples   |   Price & Delivery   |   Buy Now   |   Media
     
HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Standard Products
SAMTEC INTRODUCES NEW HIGH SPEED EDGE RATE™ INTERFACES

Samtec has expanded its high speed interconnect and cable line featuring its rugged Edge Rate™ contact system to include a new .8mm (.0315”) pitch board level system (QEM8/QEF8 Series) that is footprint compatible with Samtec’s popular .8mm (.0315”) pitch QSE/QTE Series Q Strip® high speed interconnects.

Edge Rate™ Right Angle (ERM8-RA/ERF8-RA) and Edge Mount (ERM8-EM/ERF8-EM Series) terminals and sockets offer up to 150 I/Os in single-ended or differential pair configurations with a standard choice of 10 to 75 positions per row (dependant on orientation).  Ideal for rugged and harsh environments, these strips are robust when zippered during unmating and feature an optional rugged metal latching system. 

Samtec’s full line of rugged Edge Rate™ interfaces includes high speed board level connectors, high density arrays, edge card systems, cable assemblies, and panel and I/O systems.

Back to New Products Menu

Contact Us  |   About Us  |   Jobs  |   Environmental Compliances  |   Help  |   Recent News  |   New Products
           
Copyright © Samtec, Inc