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2007
12/07
 Samtec Continues to Grow Power and Combination Signal/Power Interconnect Product Line
11/07

Samtec Introduces New PCI Express® Jumpers
11/07

Samtec Broadens High Speed Cable Line with New 75 Ohm System
11/07

Samtec Expands Line of Q2 Series Connector Strips with Right Angle and Edge Mount Designs
09/07

High Reliability Micro Contact in IP68 Sealed Circular Cable Systems
08/07

Large Variety of One Piece Interface Solutions Offered By Samtec
07/07
 New Samtec RF Board Interfaces Include Combinations with Standard Signal/Ground Connectors
06/07

Samtec Announces Micro RF IP68 Sealed Circular Cable Systems
06/07

Samtec Expands Signal Integrity Interconnect Product Line
06/07

Field Replaceable Mod Jack Introduced by Samtec
05/07
 HD Mezz Elevated High Density Arrays now Available from Samtec
03/07

Samtec Announces High Speed Differential Pair Edge Card Cable System with Rugged Latching Features
02/07

New High Speed Cables for Rugged Applications available from Samtec
02/07
 Samtec Micro Card Connectors with Edge Rate™ Contacts offer High Speed Design Flexibility
01/07

New PowerStrip from Samtec Combines High Current Carrying Capacity with Signal Routing Options
01/07

Samtec Expands High Speed Q2™ Series Flexibility with New Standard Options and Features

2006
10/06

Samtec Offers Retention Pin Options For Rugged Q2™ Series Applications
09/06
 Samtec Releases Micro Mate™ Cable Plugs For Rugged Fine Pitch Interface Applications
08/06
 Samtec Introduces New 0,635mm (.025”) Pitch Micro Card Interfaces
07/06
 Samtec Adds High Retention USB Interface to I/O Product Line
06/06
 Samtec Introduces New IP68 Sealed Circular I/O Interfaces for Rugged/Harsh Environment Applications
06/06
 Samtec Announces Micro RF Cable Assemblies for Low Profile Panel-to-Board and Cable-to-Board RF Applications
06/06
 Samtec Announces New Data Rate™ I/O Cable Assemblies for Rugged, Signal Integrity Applications
05/06
 Samtec Continues to Expand Standard Data Rate™ Cables
04/06
 New Differential Pair Arrays from Samtec
02/06
 New High Density Interconnect Arrays Available From Samtec
02/06
 New Power Interconnects from Samtec Rated at 30 Amps Per Pin
02/06
 Samtec Announces Ganged RF Board-To_Board Connectors and Cable Plugs
2005
12/05
 Samtec PCI Express Socket Line Introduced
11/05
 Micro Tiger Eye™ Contacts from Samtec Satisfy a Variety of Rugged Interface Applications
10/05
 Large Variety of One Piece Interfaces for Rugged Applications Offered by Samtec
08/05
 Samtec Micro Pitch Interconnects Save Board Area While Providing Spacing Flexibility
06/05
 New Standard D-Sub Cable Assemblies From Samtec
06/05
 Samtec Announces Cables for RF Connectors
05/05
 Samtec Introduces RF Connector Product Line
05/05
 Samtec Offers Standard & Semi_Custom Power Cable Assemblies
04/05
 New High Density Differential Arrays Available from Samtec with Final Inch® Data
03/05
 New Samtec Micro Card Socket Offers Speed and Flexibility
2004
12/04
 Samtec High Speed Flex Data Links for Signal Integrity from 60mm to 200mm Board Spacing
11/04
 Samtec RISE-UP™ System Improves Elevated High Speed Board Stacking Performance
11/04
 New High Speed Differential Pair Edge Card Cable System Introduced by Samtec
08/04
 Samtec Expands Second Generation Q Series™ Micro-Rugged High-Speed Connector System Options
07/04
 Samtec Expands I/O Interface Product Line
06/04
 Samtec Continues to Grow High Speed Cable Capabilities
03/04
 Flexible High Density Power Interconnects Introduced from Samtec
2003
11/03
 Samtec RISE-UP™ System Addresses Elevated High Speed Board Stacking Requirements
10/03
 Samtec Further "Ruggedizes" IDC Systems
10/03
 High Speed Cable Systems Available from Samtec
09/03
 New Q2™ Shielded Connector System From Samtec
05/03
 Samtec Offers Variety of High Density Interconnect Solutions
04/03
 New Hermaphroditic Connectors From Samtec Reduce Costs, Increase Flexibility
03/03
 New Micro IDC Plug on .050"(1,27mm) Pitch From Samtec
02/03
 Samtec Expands Micro Card Socket Line
2002
12/02
 Samtec Expands "Micro Rugged" Offering with New Power Mate™ Series Interconnects
10/02
 Samtec High Speed Interconnect Variety Provides Multiple Design Solutions
10/02
 Guide Posts Add Flexibility and Mating Accuracy
09/02
 Connector and EMI Cages for SFP Optical Transceiver Applications
09/02
 Design Guide Features New Flex Circuit Line
08/02
 Full Line of PC/104 & PC104+ Connectors
07/02
 Low Profile IDC Ejector Headers
07/02
 FourRay™ High Density Interconnects
06/02
 Micro Pitch Interconnects Provide Reliable Board Stacking Interfaces
05/02
 Large Variety of One-Piece Interface Solutions
04/02
 Introducing Micro-Rugged Line
04/02
 New Direct Disk Drive to Board Connectors
03/02
 New Power-Edge™ One-Piece Interface
02/02
 One Piece Power Interface Increases Power-to-Board Flexibility
01/02
 Flexibility
2001
12/01
 New Press Fit Headers and Sockets on 2mm (.0787") Pitch
12/01
 Board Stackers Offer Design Flexibility
11/01
 Micro Rugged Interconnects
11/01
 Micro IDC System Now Available
11/01
 Matched Impedance Flex Speed Interfaces
09/01
 New Elevated High Speed Interface Options
08/01
 SamArray™ Interconnects
03/01
 Expanded Low-Profile Interconnects
03/01
 Micro High Speed Differential Pairs
2000
03/00
 PCMCIA and Compact Flash Compatibility
07/00
 Application Specific Interconnects
03/00
 Shrouded Headers Offer Design Flexibility
01/00
 Micro Right Angle Interfaces
08/00
 Ultra Fine Pitch Interfaces Save Space on Your Board
1999
11/99
 New 1mm Pitch One-Piece Interfaces
10/99
 High Speed Interfaces Provide Design Flexibility
10/99
 Expanded Mini/Micro Card
02/99
 1mm Mini Flex Card Interfaces for Removable Daughter Card App.
02/99
 Mini Card Interfaces Provide the Ultimate Solution to Your Micro Card Needs
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Disclaimer: The information in the New Products area may change without notice. All information posted here is "As Is" at time of release. Samtec, Inc. does not warrant that errors or changes will be corrected.
 
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