New Differential Pair Arrays (DPAM/DPAF Series) from Samtec maximize bandwidth per square inch of board area with performance of up to a terabit per connector with up to 168 usable signal pairs. The signal pairs are on a staggered grid to reduce the number of grounds as well as simplify signal routing on the boards, and perimeter grounds reduce the number of pins dedicated to ground even further.

DP Array™ connector sets are available with 10mm and 17mm mated heights and feature lower insertion/extraction forces than many traditional open pin field arrays. Solder crimped to the tails improves solder joint reliability. Solder terminations are available with both tin-lead and a lead-free tin alloy for RoHS compliance and lead-free reflow soldering.

Final Inch® models are available which simplify specifying and using high speed connectors by extending the concept of recommended PCB pad layouts and SPICE models beyond the connector and board interface to address one of the most difficult design issues on the board, the trace breakout region around high speed connectors.

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