Samtec has expanded its popular line of .8mm (.0315”) pitch Edge Rate™ contact interfaces (ERM8/ERF8 Series) for board stacking applications with a new line on .5mm (.0197”) pitch. Featuring Samtec's rugged Edge Rate™ contacts, these systems are ideal where signal integrity and durability are critical. They provide superior impedance matching, reduced broadside coupling and crosstalk, low insertion and withdrawal forces, and high cycles.

The ERM5/ERF5 Series initial offering provides from 20 to 100 I/Os with 7mm and 10mm stack heights. The system is robust when "zippered" during unmating. For perpendicular board applications, a mating right-angle socket strip is already in development.

 The .8mm (.0315”) pitch system offers performance to 10.5 GHz @ -3dB IL for 10 to 150 I/Os.  It is the interconnect of choice for emulation applications and specified by NEXUS5001.org, POWER.org, and ARM/HSSTP. It is also available for perpendicular and co-planar applications along with mating high speed jumper cables.

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