SamArray™ high density interfaces have passed a 40 day mixed flowing gas testing which exceeds Telecordia standards which projects a 20 year reliable life.
These .050" (1,27mm) pitch interfaces (YFS/YFT/YFW Series) are available with up to 500 I/Os and with board-to-board spaces of 5mm (.197"), 7mm (.276"), 9mm (.354"), 12mm (.472"), 19mm (.748"), and 25mm (.984") between boards. They have solder ball terminations for standard BGA processing.
FOURRAY™ headers and sockets provide up to 200 I/Os in less than one square inch or 650 square millimeters, Board stack height choices are 6,35mm (.250"), 8mm (.315"), 10mm (.394") and 12mm (.472"). Surface mount terminations (TOLC and SOLC Series) are on .025" (0,64mm) pitch while through-hole applications (FOLC and MOLC Series) are on .050" (1,27mm) pitch.
FleXYZ™ 2mm (.0787") pitch interfaces provide design flexibility in all three planes by specifying the number of rows, pins per row and board spacing. Headers and stackers (YTT/YTW Series) mate with a choice of sockets (YTQ and YTS Series) to provide a range of board spacing . FleXYZ™ interconnects are available with 4, 5 or 6 rows with up to 50 pins per row.
Z-Beam™ one-piece interfaces (GFZ Series) provide high density board stacking and LGA socketing. These solderless interconnects on .050" (1,27mm) pitch eliminate solder joint realiability and solder pad delamination issues and minimize Coefficient of Thermal Expansion (CTE) concerns.
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