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High Density Interfaces Offer Design Flexibility

Samtec’s new 2mm (.0787”) pitch FleXYZ interfaces provide design flexibility in all three planes (X,Y,Z axis) by specifying the number of rows, the number of pins per row and the desired board spacing all with standard interconnects.

Square post headers (YTT Series) and board stackers (YTW Series) mate with a choic of sockets (YTQ and YTS Series) to provide board spacings from 8.35mm (.329”) to 29.6mm (1.165”). By using an elevated socket (YTE Series), the board spacing can be increased to 43.3 mm (1.705”). FleXYZ interconnects are available with a choice of 4, 5 and 6 rows with up to 50 pins per row for up to 300 I/Os per connector.

Four-row right-angle headers (TMMS Series) and mating sockets (YTQ Series) are also available for horizontal or perpendicular mating of high density boards. These connectors feature Samtec’s Tiger Buy tuning fork style contacts which provide cost-effective, high-retention connections.



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