Samtec’s micro pin-and-socket connectors on .8mm (0315”) and 1mm (.0394”) pitch significantly increase interconnect density for small form factor, micro/miniature applications without sacrificing the electrical and mechanical benefits of traditional pin and socket construction.
The 0,30mm (.012”) square terminals mate with unique dual beam Tiger Claw contacts or single beam Tiger Beam contacts. Both are suitable for pass through applications. The .8mm (0315”) system includes headers (FTE Series) and stackers (AW Series) which provide board spacings from 5mm (.0197”) to 9mm (.355”) when mated with CLE Series surface mount sockets.
The dual row interconnectors have up to 90 pins per row for pinout densities as high as 350 per square inch of board space. The 1mm (.0394”) pitch system also includes headers (FTM Series) and stackers (MW Series) with board spacings from 3.5mm (.137”) to 9.25mm (.365”) when mated with CLM or MLE Series sockets. Both systems include right-angle headers for perpendicular board interface applications.
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