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Samtec’s micro pin-and-socket connectors on .8mm
(0315”) and 1mm (.0394”) pitch significantly
increase interconnect density for small form factor,
micro/miniature applications without sacrificing the
electrical and mechanical benefits of traditional pin
and socket construction.
The
0,30mm (.012”) square terminals mate with unique
dual beam Tiger Claw contacts or single beam Tiger Beam
contacts. Both are suitable for pass through applications.
The .8mm (0315”) system includes headers (FTE
Series) and stackers (AW
Series) which provide board spacings from 5mm (.0197”)
to 9mm (.355”) when mated with CLE
Series surface mount sockets.
The
dual row interconnectors have up to 90 pins per row
for pinout densities as high as 350 per square inch
of board space. The 1mm (.0394”) pitch system also
includes headers (FTM
Series) and stackers (MW
Series) with board spacings from 3.5mm (.137”)
to 9.25mm (.365”) when mated with CLM
or MLE
Series sockets. Both systems include right-angle headers
for perpendicular board interface applications.
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