New Samtec SEARAY™ high density interconnects (SEAM/SEAF Series) provide a solid grid of contacts on .050” (1,27mm) pitch and up to 500 I/Os. These connectors are the same footprint as the popular SamArray® Series connector, but with added features and stack heights.
Lower insertion/extraction forces make the connector much more user-friendly and a choice of solder-crimps on the tails provide a choice of traditional tin-lead alloy or RoHS compliant tin-only for lead-free processing. Stack heights of 7mm, 8.5mm, and 10mm are offered along with array sizes of 8 or 10 rows by 20, 30, 40, or 50 pins per row.
Pins may be routed single-ended or differentially in SEARAY™ connectors. Performance for the SEARAY™ at a -3dB insertion loss is 4 GHz for single-ended applications and 9 GHz for differential pair applications. For dedicated differential applications, Samtec offers DP Array™ connectors (DPAM/DPAF Series) with performance of up to a terabit per connector with up to 168 useable signal pairs. The signal pairs are on a staggered grid to reduce the number of grounds as well as simplify signal routing on the boards.
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