Samtec Expands Signal Integrity Interconnect Product Line

Samtec’s ability to provide “Signal Integrity at any Distance™” is being aggressively expanded with new interconnects and signal integrity services.  New solutions for Panel and I/O, Cable Assemblies and Board-to-Board applications have been developed as well as expanded signal integrity design resources including Final Inch® PCB design tools.

Board-to-Board solutions include single-ended and differential pair Q Series®, Q2™ Series, and Edge Rate connector strips, elevated board stackers, right angle and card edge systems for perpendicular and co-planar board mating.  A variety of high density solutions are available including SEARAY™ open pin field arrays, HD Mezz elevated stacking arrays, and DP Array® dedicated differential arrays.

Cable solutions feature Samtec’s Data Rate high speed coax and twinax cable or high speed flex terminated with a variety of high speed and standard connectors.  Data Rate I/O interfaces are available with conventional shielded twisted pair cable construction or Samtec Low Skew Pair cable for higher speed applications. 

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