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Introduction
Purpose
Lower Installed Cost
SMT INTERCONNECT PLACEMENT
Metal Pick-And-Place Pads
No Pad
Remove Pins For Landing Area
Custom Nozzles To Eliminate Pads
Molded Pad
Single Pad On Multiple Connectors
IR COMPATIBLE BOARD PROCESSING
Intrusive Reflow
Metal Washers
Solder Preforms/Stepped Stencil
Mixed Technology Interconnects
Preventative Measures
REGISTRATION
Pad On Multiple Interconnects
Alignment Of Connectors To Pads
Positive Polarization
COPLANARITY
Stamped Leads
Heel Coplanarity
OPENS
Squeegees
Flux / Paste Ratio
Stencil Aperture
BRIDGING
Solder Thieving Pads
Board Layout
Aperture Configuration
BOARD WARPAGE
CONTACT OPTIMIZATION
Flex Shroud System
End Shrouds
Alignment pins
Board Guides
Locking Clips
Board Locks
Ejector Shrouds
Troubleshooting
Opens
Bridging
Interconnect Processing Group
Overview
© 1997 SAMTEC
