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Samtec has published Processing information on several products. Listed below are the products that we have literature on and a brief overview of the information contained in the literature. Click on the picture to view an on-line version of the literature or click the Order Literature link to request a printed version of the literature.

If you do not find the information that you are looking for in the information below or require more information, see how our Interconnect Processing Group can help you or send us more details on your specific application.

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QXS-RA Samtec Connector Rework Procedure
x This sheet includes guidelines for reworking Samtec connectors. on-line version only
HD Mezz (HDAM/HDAF Series) Processing Report
This run was to verify process ability of Lead option for the High Density Mezzanine
(HDM-Plug/HDM-Receptacle) series connectors.

*HZ Mezz is a trademark of Molex Incorporated 		On-line version only.
SEARAY™ (SEAF/SEAM Series) Processing Report
This run was to verify process ability of both the Lead and No-Lead options for Samtec's SEARAY™ (SEAF/SEAM Series) Open Pin Field Array Connectors. On-line version only.
Grid Array Rework Guidelines
Guidelines for reworking Grid Array Connectors On-line version only.
QXX/BXX Connector Rework Methods

This sheet includes guidelines for reworking QXX/BXX connectors.

 

 On-line version only
Edge Mount Interfaces
This Data Sheet includes processing guidelines for edge-mount Q Strip® Interfaces. On-line version
only


This Data Sheet includes processing guidelines for edge-mount Q2™ Interfaces.

Data Sheet is available in
PDF format only.

On-line version only.
Paste in Hole (PIH) Printing
Paste in Hole, Through-hole printing is an alternative to wave soldering through hole connectors. This Speedline Technologies Applications Note is a quick reference on many of the papers written on this subject and outlines the necessary design criteria for successful printing.
 PDF Version
Flex Processing Guide
The Flex Processing Guide addresses common problems encountered in the processing of surface mount connectors, SMT compatible through-hole connectors and self nesting sockets. It also explores the advantages and disadvantages
of locking clips, alignment pins and pick-and-place pads.

 

Text-only Version
Signal Integrity Handbook
This handbook is designed as a reference for those with little or no signal integrity experience who are tasked with selecting a high speed interconnect.  It will help enable you make an informed decision when specifying components that will affect the signal integrity of your system. Download PDF Version
 
Interconnect Processing Handbook

Samtec's Interconnect Processing Handbook addresses common conditions encountered in surface mount and IR compatible board processing and possible solutions. Our goal is to assist you in lowering the total applied cost of your board, improve the overall processing and manufacturability of your board and to resolve interconnect processing concerns.

 Text-only Version
Surface Mount Product Design Considerations

Our Surface Mount Handbook addresses the major issues and challenges associated with the design specification and use of surface mount interconnects including insulator, lead design and contact/terminal design.

 Text-only Version
 
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