Listed below is the processing literature we have available and a brief overview of the
information contained in the literature. Click on the link to view
an on-line version of the literature or right click to download a copy to your computer.
If
you do not find the information that you are looking for
below or require more information, see how our Interconnect
Processing Group can help you or send us more
details on your specific application.
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| PROCESSING GUIDES |
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Solder Joint Pass/Fail Criteria for SEARAY™
Connectors
Download PDF version |
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Spirit® Test Probe Application Manual
Application manual for assembling the Test Probe and replacing the Spirit® Connector (SCTP Series)
Download PDF Version |
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SEARAY™ SEAM/SEAF Processing Recommendations
Soldering recommendations for Samtec's unique SEARAY™ solder charge design.
Download PDF Version
Download PDF Chinese Version |
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Solder Charge Technology Video
Media Room video explaining the solder charge technology featured on the high density SEARAY™.
Click to view video |
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HD Mezz (HDAM/HDAF Series) Processing Report
This run was to verify process ability of Lead option for the High Density Mezzanine
(HDM-Plug/HDM-Receptacle) series connectors.
Download PDF Version
*HZ Mezz is a trademark of Molex Incorporated |
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Edge
Mount Interfaces
This
Data Sheet includes processing guidelines for edge mount Q Strip® Interfaces.
Download PDF Version  |
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Edge Mount Q2 Interfaces
This
Data Sheet includes processing guidelines for edge mount Q2 Interfaces.
Data Sheet is available
in
PDF format only.
Download PDF Version |
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Press Fit Procedures
Watch three animations showing:
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Paste
in Hole (PIH) Printing
Paste
in Hole, Through-hole printing is an alternative to wave soldering through
hole connectors. This Speedline Technologies Applications Note is a quick
reference on many of the papers written on this subject and outlines the
necessary design criteria for successful printing.
Download PDF
Version |
| REWORK GUIDES |
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Grid
Array Rework Guidelines
Guidelines for reworking
Grid Array Connectors
Download PDF Version
Download PDF Chinese Version |
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QXX/BXX
Connector Rework Methods
This sheet includes
guidelines for reworking QXX/BXX connectors.
Download PDF Version |
| HANDBOOKS |
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Signal Integrity Handbook
This handbook is designed as a reference for those with little or no signal integrity experience who are tasked with selecting a high speed interconnect. It will help enable you make an informed decision when specifying components that will affect the signal integrity of your system.
Download
PDF Version |
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Flex Processing Guide
The
Flex Processing Guide addresses common problems encountered in the processing
of surface mount connectors, SMT compatible through-hole connectors and
self nesting sockets. It also explores the advantages and disadvantages
of locking clips, alignment pins and pick-and-place pads.
Text-only
Version |
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Interconnect Processing Handbook
Samtec's
Interconnect Processing Handbook addresses common conditions encountered
in surface mount and IR compatible board processing and possible solutions.
Our goal is to assist you in lowering the total applied cost of your board,
improve the overall processing and manufacturability of your board and
to resolve interconnect processing concerns.
Text-only
Version |
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Surface
Mount Product Design Considerations
Our
Surface Mount Handbook addresses the major issues and challenges associated
with the design specification and use of surface mount interconnects including
insulator, lead design and contact/terminal design.
Text-only
Version |