HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Standard Board-to-Board
HERMAPHRODITIC CONNECTORS 
Self Mating Systems Specifications
Specifications
  • Pitch
    • 100” (2,54mm)
    • 2mm (.0787")
    • .5mm (.0197")
    • .635mm (.025”)
    • .8mm (.0315")
  • Contacts: Up to 100 I/Os
  • Stack: 11mm - 35,5mm
Series
 
Features
  • Self mating system
  • Reduces inventory
  • Shrouded
  • Audible click when mated
  • Polarized
  • Ideal for rugged applications
  • LSS, LSHM, & LSEM used in high speed applications
Additional Links

If you do not find the product series you are looking for above, please contact eNewProducts.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www.samtec.com/TS for complete details.
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