Series

HDAM 2,00 mm x 1,20 mm HD Mezz™ Rugged, High Density Open Pin Field Array Terminal

The ET60S Socket and ET60T Terminal Series is a modular high-current power and signal connector system in a coplanar and right-angle board-to-board orientation.

Designed as a higher current and lower profile power interconnect than existing connectors, the EXTreme Ten60Power™ connector provides maximum current-to-length ratio packaged in a low-profile, 10mm (.394”) height housing that enhances system airflow within the power system. Both the plug and receptacle utilize reliable, proven power and signal contact designs.

Features

• Application Specific capability to build any height from 20,00 mm to 35,00 mm.
• Open Pin Field design.
• Integrated Guide Posts to minimize contact damage when mating and unmating.
• Solder charge termination for ease of processing.
• Performance up to 9 GHz / 18 Gbps .
• 1,20 mm X 2,00 mm pitch.
• Up to 299 I/Os.
• Intermateable with Molex HD Mezz.
• HD Mezz is a trademark of Molex Incorporated.
• Dual sourced by Molex®.

Certifications

Mating Connectors

HDAF Pair Mates View Series

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ACD, ASP, CEP, CIP, HDR, IM, LF0100, LF0150, MEP, OTP, PCBA, REF, RSP, SCF, SEP, SME, SUB-ASP, TCD Series - Information is not available here for Application Specific Products. Contact eASP for any information on this series of connectors. To create a new Application Specific Product, please visit our Custom Products Section.

For information on our ASP connectors used in Agilent Logic Analyzer and other Test Probes and Debug Devices, Vita 42 XMC/RapidIO, Micro High Frequency, Nokia M2M, Altera, and PC/104 Express applications, please visit our Highlight ASP area.

To ensure a product meets TS 16949, automotive, or any other specific standards, the product must be an ACD Series. Go to www12.samtec.com/TS for complete details.

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Series

HDAM 2,00 mm x 1,20 mm HD Mezz™ Rugged, High Density Open Pin Field Array Terminal

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