| ARTICLES
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12/08
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A New High Speed Transmission Line Technology |
Jamal S. Izadian, Ph.D, RFConnext, Inc., Microwave Journal
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12/08
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Samtec, along with StackableUSB are chosen 2008 Best Electronic Design Winner for the Embedded USB Standard. |
SBS
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12/08
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USB Thinks Inside the Box |
SBS
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11/08
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Emad Soubh Interview in Test Magazine |
Test Magazine, Korea
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09/07 |
Selecting cable for high-speed applications |
Ralph Raiola
Electronic Products Magazine |
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09/07 |
TDR and S-parameter measurements: How much performance do you need? |
Dima Smolyansky
Tektronix Inc |
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06/07 |
How to Simplify Hardware Prototyping with EXP Modules |
Jim Beneke, Avnet
Programmable Logic - Design Line
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02/07 |
XMC:
Enhanced Connector Design Solves Insertion/Removal Stress |
Ivan
Straznicky
Curtiss-Wright Controls Embedded Computing
David Givens, Samtec, Inc. |
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09/06 |
On-line
Tools Work to Ease Design Efforts |
Microwave
RF Notebook
Nancy Friedrich |
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10/05 |
Selecting
Connectors for Differential Applications |
Julian
Ferry &
Russell Moser
Electronic Products |
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09/05 |
TDR
For Differential Pair Characterization |
Abe
Riazi
Printed Circuit Design and Manufacture |
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| 03/05 |
A
Solution for the Design, Simulation and Validation of Board-to-Board Interconnects |
Julian
Ferry
High Frequency Deign |
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| 02/05 |
Samtec
Receives 2005 Design Vision Award |
Connector
Specifier |
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| 08/04 |
Materially
Deficient - Think your parts are green? Be prepared to prove it! |
Michael
Kirschner
Electronic Business |
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| 09/02
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Vendors
spin components and subsystems
for tougher times |
Martin
Gold
EE Times |
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| 07/02
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Connectors
pushing toward data rates of 10 Gbits/s |
Gina
Roos
EE Times |
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| 02/02
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Midtier
connector makers fight to survive consolidation |
Spencer
Chin
Planet Analog |
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| 07/01 |
BGA
socket makers lob finer pitches with new processes |
Hailey
McKeefry
EE Times |
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| 02/01
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Brian
Vicich
Samtec |
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| 02/01
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Connector
system hits 10 GHz without signal degradation |
Bettyann
Liotta
EE Times |
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