|
DATE |
TITLE |
AUTHOR/
PUBLICATION |
| 02/10 |
DesignCon 2010
Quality of High Frequency Measurements Tech Forum |
Jim Nadolny - Samtec, Inc.
Tom Dagostino - Teraspeed Consulting Group LLC
Yuriy Shlepnev - Simberian
Scott McMorrow - Teraspeed Consulting Group LLC |
| 02/10 |
DesignCon 2010 Shielded Flex Circuitry - What Drives Performance |
Jim Nadolny
Julian Ferry |
|
02/09 |
DesignCon 2009 RealTime interview with Julian Ferry, Samtec’s High Speed Engineering Manager.
|
Julian Ferry, Samtec
|
|
02/09
|
DesignCon 2009 - Characterizing Non-Standard Impedance Channels with 50 Ohm Instruments |
Samtec, Inc.
Agilent Technologies, Inc. |
|
07/08
|
Power Integrity Engineering
DC Power Integrity |
Scott McMorrow
Samtec |
|
02/08
|
DesignCon 2008 - RealTime interview with Brian Vicich on how Samtec
makes the PCB designer’s job easier.
|
Brian Vicich, Samtec |
|
02/08
|
DesignCon 2008 - Pushing the Envelope without Tears: An Advanced Power Delivery
Solution |
Steve Weir, Teraspeed Consulting |
|
02/08
|
DesignCon 2008 - Test Fixturing and Measurement Methodology
|
Emad Soubh, Samtec,Inc.
Brock LaMeres, Probing Technology
Brent Holcombe, Probing Technology |
|
02/08
|
DesignCon 2008 - Mode Conversion and EMI Performance
|
Jim Nadolny
Samtec, Inc. |
|
12/07 |
Shielded Cable Assemblies & EMI Performance
|
Jim Nadolny
Samtec, Inc. |
|
04/07 |
Understanding Samtec's Electrical Circuit Simulation Models of Cable Assemblies
|
Corey Kimble
Samtec |
|
02/07 |
PCB Design Methods for Optimum FPGA SerDes Jitter Performance - DesignCon 2007
|
Steve Weir
Teraspeed Consulting |
|
02/07 |
A New Innovation: Connectorless Probing Enables High Speed Serial Protocol
Testing - DesignCon 2007
|
Barbara P. Aichinger
FuturePlus Systems Corp. |
|
01/07 |
Design and Application of an Optical Backplane Connection System - DesignCon 2007
|
Brian Vicich, Ken Hopkins,
Richard Pitwon |
|
01/07 |
A Novel Procedure for Characterization of Multi-Port High Speed Balanced Devices
- DesignCon 2007 |
Jim Nadolny
Vahe' Adamian |
|
12/06 |
Link Path Modeling for SI Analysis
|
Jim Nadolny |
|
06/06 |
Cable Assembly Modeling |
Jim Nadolny |
|
02/06 |
IBIS Connector Models: Facts vs. Fiction - DesignCon 2006 TecPreview
|
Jim Nadolny
Corey Kimble |
|
11/05 |
Advanced Edge Card Transitions
|
Scott McMorrow
Teraspeed Consulting |
|
09/05 |
Simplified Design and Modeling of Surface Mount Connector Pad Transitions for Applications
at 10 to 20 Gbps NRZ
|
Brian Vicich, Samtec,
Scott McMorrow, Teraspeed |
|
08/05 |
How to Use Connector Spice Models
|
Scott McMorrow |
|
06/05 |
Understanding the Apparent Impedance of Interconnects
|
Julian Ferry |
|
03/05 |
Designing High Speed Cable Assemblies
|
Scott McMorrow |
|
02/05 |
RoHS Compliant
|
Jan Hrouda |
|
02/05 |
Final Inch® - A Plug-and-Play reference Design Solution for High Speed Interconnects
|
Julian Ferry |
|
12/04 |
High Speed Flex Circuit Design Considerations
|
Scott McMorrow |
|
08/04 |
Connector Pinout - the Art and Science of Connector Grounds |
Scott McMorrow |
|
04/04 |
Designing High Speed Cable Assemblies
|
Emad Soubh |
|
04/04 |
Webinar -
Advances in Design, Modeling, Simulation and Measurement Validation of High Performance
Board-to-Board 5 to 10 Gbps Interconnects |
Brian Vicich, Samtec,
Scott McMorrow, Tom Dagostino, Bob Ross, Teraspeed,
Rob Hinz, Cider Designs |
|
02/04 |
DesignCon -
Advances in Design, Modeling, Simulation and Measurement Validation of High Performance
Board-to-Board 5 to 10 Gbps Interconnects |
Brian Vicich, Samtec,
Scott McMorrow, Tom Dagostino, Bob Ross, Teraspeed,
Rob Hinz, Cider Designs |
|
11/03 |
Samtec Connector Models for Electrical Simulation
|
Corey Kimble |
|
09/03 |
Optimizing Flex Circuitry
|
Glenn Menear |
|
07/03 |
Final Inch®
|
Dave Givens |