HIGH SPEED BOARD-TO-BOARD
EDGE CARD / MICRO BACKPLANE
MICRO PITCH BOARD-TO-BOARD
STANDARD BOARD-TO-BOARD
RUGGED / POWER
HIGH SPEED CABLE ASSEMBLIES
RF CABLE AND COMPONENTS
IDC / DISCRETE WIRE
PANEL & I/O
STANDARDS / PLATFORMS
CUSTOM PRODUCTS
PRODUCT INFORMATION
QUALITY / PROCESSING / TOOLS
SIGNAL INTEGRITY SERVICES
RUGGED / POWER INTEGRITY
SUDDEN SERVICE
SERVICE CENTER
TECHNICAL LIBRARY
 
Technical Library
Articles
Below is a list of current Samtec Articles. Click on the title to be directed to that specific Press Release or click on the download button to save a zipped PDF file to your hard drive.  For more information click one of these sources: Presentations, Press Releases, Technical Documents or White Papers.

For additional Signal Integrity resources and training, click here.

Click here to view our Application Notes.

DATE TITLE AUTHOR/
PUBLICATION
02/11 A Mid-life Kicker for Circuit Board Technology Eric Bogatin for EE Times
04/09
Samtec receives Best Product Award in Electromechanik and Connectors
EE Publish Industry
12/08
Samtec, along with StackableUSB are chosen 2008 Best Electronic Design Winner for the Embedded USB Standard.
SBS
12/08
USB Thinks Inside the Box
SBS
11/08
Emad Soubh Interview in Test Magazine
Test Magazine, Korea
09/07
Selecting cable for high-speed applications
Ralph Raiola
Electronic Products Magazine
09/07
TDR and S-parameter measurements: How much performance do you need?
Dima Smolyansky
Tektronix Inc
06/07
How to Simplify Hardware Prototyping with EXP Modules
Jim Beneke, Avnet Programmable Logic - Design Line
02/07
XMC: Enhanced Connector Design Solves Insertion/Removal Stress
Ivan Straznicky
Curtiss-Wright Controls Embedded Computing
David Givens, Samtec, Inc.
09/06
On-line Tools Work to Ease Design Efforts
Microwave RF Notebook
Nancy Friedrich
10/05
Selecting Connectors for Differential Applications
 Julian Ferry &
Russell Moser
Electronic Products
09/05
TDR For Differential Pair Characterization
Abe Riazi
Printed Circuit Design and Manufacture
03/05
A Solution for the Design, Simulation and Validation of Board-to-Board Interconnects
Julian Ferry
High Frequency Deign
02/05
Samtec Receives 2005 Design Vision Award
Connector Specifier
08/04 Materially Deficient - Think your parts are green? Be prepared to prove it!
Michael Kirschner
Electronic Business
09/02
Vendors spin components and subsystems
for tougher times
Martin Gold
EE Times
07/02
Connectors pushing toward data rates of 10 Gbits/s
Gina Roos
EE Times
02/02
Midtier connector makers fight to survive consolidation
Spencer Chin
Planet Analog
07/01
BGA socket makers lob finer pitches with new processes
Hailey McKeefry
EE Times
02/01
Brian Vicich
Samtec
02/01

Connector system hits 10 GHz without signal degradation
Bettyann Liotta
EE Times

Contact Us  |   About Us  |   Jobs  |   Environmental Compliances  |   Help  |   Recent News  |   New Products
           
Copyright © Samtec, Inc