Items to be considered include connector performance, routing efficiency, and pin density. For more information, contact our Signal Integrity Group.

The following information about your application will help determine if a connector system can meet the signal integrity requirements: - System Topology: point-to-point, multi-drop, point-to-many-point, Star, etc - Termination Type: Parallel (one/both ends), Series, Active, RC, none - Clocking/Data Recovery: synchronous, asynchronous, source synchronous, CDR - Signaling Type: Single-Ended or Differential - Data Encoding: Binary, PAM-2, PAM-4, etc - Signal Technology: examples include LVTTL, SSTL-2, Rambus, LVDS, PECL, CMOS, GTL+ - Signal Data Rate: specified in Mbps or Gbps - Signal Edge Rate: specify 10/90 or 20/80 - System Impedance - specified in ohms along with tolerance (e.g., +/- 10%) - Crosstalk Requirements: specified at receiver (in % of voltage swing or dB) - Skew Requirements: specified in pico-seconds We can then use the above information to make educated recommendations. For more information, contact our Signal Integrity Group.

Always choose the shortest connector that can do the job. The shorter the connector, the shorter period of time for reflections and crosstalk to act, and the better the signal quality. For more information, contact our Signal Integrity Group.

A signal-to-ground ratio of 1:1 is usually optimal, but for connectors with large pin arrays signal-to-ground rations of less than 1:1 may be required for reliable high speed single-ended operation. For more information, contact our Signal Integrity Group.

For differential connectors running at 2.5 Gbps and above, ground shielding of the pairs can be very beneficial. For more information, contact our Signal Integrity Group.

No. A connector's impedance profile changes with respect to change in signal-to-ground ratio. The "exposure" of the impedance discontinuities within the connector is dependent on the edge/fall rate of the signal propagating through the connector.

No. The impedance discontinuities inherent to the connector's design are independent of the characteristic system impedance.

Yes; here are some guidelines for assigning pins for power distribution:

* If the connector has ground blades (e.g., Q-series) that are used to distribute power through the connector, and the connector is used for high-speed signaling, then the following should be done: All signals passing through that section of the connector should be referenced to the same power plane being passed through the connector on both sides of the board, OR if referenced to ground, the power plane should be adjacent and close to the ground plane on both PCBs. This recommendation will ensure that the signal return path is unbroken across the connectors, increasing bandwidth and decreasing EMI.

* If signal pins are used to distribute power through the connector, they should be placed considering the noise which can occur due to signal coupling. Signal pins passing power and ground are as susceptible to noise as any signal pin would be. Sensitive power signals should be well isolated with grounds on either side to reduce crosstalk. And for low noise power, such as a precision voltage reference, it may be necessary to isolate the power pin with multiple grounds on either side, and on the back side of the connector.

Check out Samtec's Signal Integrity Circuitry E-mail Tips. You can register to receive Signal Integrity tips via e-mail monthly and/or view our on-line archives of past Signal Integrity tips. You can also view our new online eBrochures.

Yes, Samtec now has on-going webinar events. Check out their schedules today to see when Signal Integrity is the next topic.

Samtec offers single-line and multi-line structures. The models represent MATED connectors (male and female connectors or card edge connector with edge card inserted).

The SLM is used to evaluate the effects of a single set of connector pins. A SLM is independent of connector wiring pattern and is an approximation of a well referenced connector. The MLM differs from a SLM in that it accounts for the electrostatic and electromagnetic coupling, as well as the common impedance noise found in a connector. Its structure couples in three dimensions all pins to each other. This results in a complex model that uses series resistance, inductance, coupling capacitance and inductive coupling coefficients so arranged to allow connections at both the input and output. This modeling effectively shows the coupled noise. This is done, though, at the expense of CPU runtime.

Single-Line models can be used to analyze - propagation delay, - attenuation, - reflections, - drive power, - timing. A SLM CAN NOT BE USED TO EVALUATE CROSSTALK! (FOR CROSSTALK - A MULTI-LINE MODEL MUST BE USED.)

Multi-Line models can be used to analyze - propagation delay, - attenuation, - reflections, - drive power, - timing - electrostatic coupling - electromagnetic coupling - common mode noise - crosstalk

Samtec employs an industry proven ladder lumped element modeling process. The elements are derived using 2D field solver software. Samtec is also investigating other modeling techniques (e.g., full 3-D modeling, measurement-based modeling) which would be better suited for more complex structures (e.g., cable assemblies, flex circuits).

The models are text files that can be viewed with any text editor.

Typically, SMT connector boundaries are defined to be from the male connector's SMT tail to the female connector's SMT tail (SMT pads are NOT included). For T/H connectors, the boundaries are defined to be from the PCB surface of the male connector to the PCB surface of the female connector. For all connector models, terminations, driving sources, and parasitic capacitance are NOT included. For card edge connectors, the boundaries are defined to be from the SMT tail (or PCB surface for T/H) of the connector to the route-out side of the edge card pad (edge card pad is included).

Samtec's connector model's are classified as one of the following: - Validated: Model created using Samtec's defined modeling techniques. Simulation data from the model correlates with test data from the connector. - Developmental: Model created using Samtec's defined modeling techniques, but has not yet been correlated against test data. These models may be "soft validated", where simulation data from the model is correlated with data obtained from a full wave 3D simulation. - Estimated: Model was created using engineering approximations (e.g., design similarities with another connector that has been modeled)

Samtec supports the following simulation tools with connector models: Synopsis HSPICE, Cadence PSPICE, Mentor Graphics ICX (MMF format), Cadence SPECCTRAQuest SigXplorer (DML format), HyperLynx LineSim (SLM format), and HyperLynx 7.5 ELDO.

Yes, the structure of the SPICE connector model is such that it should run in simulators based on Berkeley SPICE 3F5.

The IBIS Interconnect Modeling Specification (IBIS ICM 1.0) was approved on September 12, 2003 (http://www.eda.org/pub/ibis/connector/). Samtec is an active member of the IBIS Open Forum and plans on working towards providing true IBIS models now that the IBIS ICM specification has been approved. To date, Samtec has developed "SLM_general" ICM models. Availability of other ICM model types will be dependent on the simulation software vendors ability of importing IBIS ICM compatible models into their simulation packages.

Contact our Signal Integrity Group and communicate your need for a model. We will work with you to help assess what is required and then add the request to our model production schedule.

Please visit the following link: Test Procedures.

Please visit the following link: Connector System Speed Rating.

(a) Impedance profile of the connector will not change, because the impedance discontinuities inherent to the connector's design are independent of the characteristic system impedance
(b) Propagation delay through the connector will not change because the inductive and capacitive properties inherent to the connector's design are independent of the characteristic system impedance
(c) Crosstalk (percentage of voltage swing) will not be affected. Crosstalk is a measure of the coupling between circuits, and is due to inductive and capacitive coupling within the connector. The coupling properties inherent to the connector's design are independent of the characteristic system impedance.
(d) Insertion and Return Loss may be affected. As system characteristic impedance changes, the overall impedance mismatch between the system and connector may vary. This causes a change in the reflection coefficient caused by the connector; which would result in a change in return loss and insertion loss.

Federal requirements (FCC 47 CFR Part 15, EN55022, etc.) require EMI compliance testing of active electronic systems such as computers. While passive components can impact the overall system level EMI performance, it is not possible to directly test a connector, cable assembly, resistor, or bolt for EMI compliance.

Do shielded connectors and cable assemblies help reduce emissions and improve immunity of electronic products?

Yes they can help, and in some cases dramatically. Signals that have periodic switching such as clock lines are a classic noise source. If energy from this type of source couples to a cable that exits a shielded enclosure, the cable can radiate the coupled noise much like a cell phone antenna radiates (although not as efficiently). Placing a shield over the cable (and terminating the shield properly) can reduce the radiated emissions dramatically. For a board to board connector inside an enclosure, the situation is similar except the radiated emission occurs inside the enclosure so the radiated emission may or may not be visible during an EMI test.

How much shielding does the Q2™ products have compared to Q Series™ products?

Testing showed an improvement of 10-20 dB over the frequency range of 1-4 GHz and 0-10 dB from 4-10 GHz. This was a comparison test where the radiated field of the shielded connector (Q2™) was compared to the radiated field of an unshielded connector (Q Series™). The key to a meaningful test is that all variables in the test setup and on the test board need to the same for both tests. Full wave simulation showed an improvement of approximately 10 dB over the 1-10 GHz frequency range as well.

What are the best practices to reduce EMI when using a board to board (BTB) connector?

There are a few assumptions that need to be stated up front before we get into answering this question:

1. We are addressing open pin field connectors like the Samtec QSE/QTE or SEAM/SEAF series, not a coaxial RF connector configured for BTB applications
2. We are primarily interested in digital applications that span kbps to Gbps data rates.  We are not addressing very low frequency analog (audio) type applications.
3. The connectors are part of an overall interconnect system that can include printed circuit boards (PCBs). 

It is important to understand the radiation mechanism or dominant EMI antennas in a BTB system.  One analogy that works well is to consider the PCB ground planes as elements of a microstrip patch antenna.  Any longitudinal voltage potential developed across the connector appears as a voltage source which serves to drive the PCB ground planes, not unlike a feed element driving a microstrip patch antenna.  This is a useful low frequency (50 MHz to 100’s of MHz) approximation; at higher frequencies the radiating system is more complex but the best practices remain the same.

To minimize the longitudinal voltage potential across a connector, we need to minimize the self-partial inductance of the signal return path.  Some brief terminology definitions are needed:

1. Loop inductance is the only inductance that is “real” or can be measured. 
2. Self-partial inductance is a useful mathematic construct; it can be calculated but not directly measured.
3. “Self” means we are interested in the magnetic flux developed from only one conductor of the loop. 
4. “Partial” means we are looking at only a portion of the path, specifically the portion between the PCBs.

To minimize the self-partial inductance across the connector there are some general principles to follow:

1. A short BTB stack height is better than a taller BTB stack height.
2. Minimize the loop area in the connector by having ground pins integrated into the signal pin field (1:1).
3. Use broad, flat conductors for signal return, dedicated planes are superior to pins for signal return
4. Make the characteristic impedance of the signal and ground pattern as low as possible. 

If EMI were the only issue, the BTB connector should have a very low characteristic impedance (<1Ω).  Planar distribution for signal and return currents would have the lowest self partial inductance across the connector and the lowest EMI.  Clearly this is not a practical guideline as data transmission requirements dictate a close match to the system impedance (typically 50Ω).

The same physics that applies to EMI reduction in BTB connectors also apply to PCBs.  Disruptions in the signal return path such as splits in the ground plane drastically increases the self partial inductance of the return path which can lead to EMI problems. 

The best EMI strategy for electronics is to consider multiple areas such as PCB design (stackup and circuit layout), connector selection, signal return management (grounding), power filtering (decoupling/PI design) and logic selection with an emphasis on spread spectrum clocking and edge shaping.

Samtec has an in-house electrical test lab and engineering staff available to field Flex Circuitry questions and make recommendations. Our Flex Circuits Group can handle the entire operation from concept to completion.

Register to receive Flex Circuitry E-mail Tips from Samtec on a regular basis.

Review our Flex Circuit Overview.

Can you builda flex circuit on-line with Samtec?

Samtec Sudden Circuits are quick-turn, highly configurable, high speed data links for both low and high volume applications. Sudden Circuits feature traditional flex circuit materials and Samtec connectors using new direct imaging technology. Sudden Circuits hinges on three key features: 1) Tremendous design flexibility, 2) quick delivery and competitive pricing, and 3) an easy on-line builder our Sudden Circuits Solutionator.

Yes, Samtec now has on-going webinar events. Check out their schedules today to see when Flex Circuitry is the next topic.

The answer to this question can vary depending on copper thickness and trace width. The easiest way to answer this is to visit the following address, http://www.ultracad.com/trace.htm, there you will find charts and a detailed explanation of how to determine current carrying capacity. For more information, contact our Flex Circuits Group.

The rule of thumb is 10 times the total thickness of the flex itself , i.e. a flex .010" thick would have a minimum bend radius of .100". For more information, contact our Flex Circuits Group.

Click here to view our Minimum Bend Radius Chart for our standard flex circuit assemblies.

You add a stiffener to the area opposite of any components soldered to the surface of the flex. This adds rigidity to the flex allowing for a planar surface to mount to. It also supports the solder joints and reduces the stress on the joint. For more information, contact our Flex Circuits Group.

This depends on the construction. Single sided flex, with copper in the neutral axis, can typically be flexed 1000 times. Double sided flex, with pads only plated vias, can probably flex several thousand times. A multilayer is typically flexed to install, and it is not recommended for repeated flexing. For more information, contact our Flex Circuits Group.

Yes, silver epoxy can be screened over openings in the coverfilm layer to access signal layers beneath it. However, the typical use is for now powered grounds or shields. In some applications, a small amount of current can be passed through a silver epoxy conductor. For more information, contact our Flex Circuits Group.

Yes, you can find a copy of the Power Testing Standards White Paper by clicking here.

Working Voltage is listed in VAC, but what is it in VDC?

The DC rating is the peak of the sine wave from the AC rating, which is 1.414 times the rated VAC.  For more information, click here to review our Power and Voltage Ratings White Paper.

The Current Carrying Capacity is based on what voltage?

The CCC is applicable up to the rated working voltage.

These questions need to be answered on a per application basis.  Please contact our Engineering Support Group.

Samtec measures at the centralized hot spot of the contact or contact grouping with a calibrated thermocouple.  Click here to view a photo of our lab set-up.

This question needs to be answered on a per application basis.  Please contact our Engineering Support Group.

Does Samtec have a procedure specifically for their testing of power products?

Contact our Engineering Support Group for these types of questions.

Samtec's Interconnect Processing Group is an in-house staff of Engineers to field all your interconnect processing concerns.The IPG can assist you improve the overall processing and manufacturability of your board as well as help lower its total applied cost.

Check out Samtecs Interconnect Processing E-mail Tips. You can register to receive Interconnect Processing tips via e-mail monthly and/or view our on-line archives of past Interconnect Processing tips. You can also view our new online eBrochures.

Yes, Samtec now has on-going webinar events. Check out the schedules today to see when Interconnect Processing is the next topic.

The fundamental theory behind PIH is that a printed volume of solder paste on a PWB, and over the plated through hole, will reflow into the hole and around the contact or terminal lead while being processed through an IR oven set at typical surface mount parameters. The key to success is printing a sufficient solder volume to fill the hole and, hopefully, obtain robust fillets. However, space limitations and stencil thickness may prevent the possibility of the latter. Per IPC-A-610C, a minimum of 75% of the hole must be filled to produce an acceptable class 1, 2 or 3 joint. As with most things, convenience comes at a cost. If a lack of solder fillets is something you may be willing to sacrifice, while maintaining IPC adherence, paste in hole processing may be a viable alternative to multiple processing runs. For more information on PIH Processing, contact our Interconnect Processing Group.

Position similar connector with regard to location and orientation as close to each other as possible so that they experience similar processing conditions simultaneously. Also, avoid using alignment features incorporated into the parts such as alignment pins or locking clips as the tolerances between them and the associated board features could enhance a problem. Finally, minimize the number of board-to-board connectors used in a single application when possible and investigate the use of fixturing to hold the multiple connectors in place during reflow. For more information on processing multiple fine pitch SMT connectors, contact our Interconnect Processing Group.

When processing the Q Series edge mount connectors, the solder paste is placed on the ends of the pads farthest away from the board edge. This is done to minimize the distance the signal leads must travel through the wet paste when the connector is placed on the board. This reduces the "plowing" of the past and the risk of bridging between signal pads. For more information, contact our Interconnect Processing Group.

Samtec is represented by technical sales organizations and stocking distributors all over the world.

See Samtec's On-Line Rep/Distributor Roster: The Americas, Europe/Middle East/Africa, Asia

Samtec, Inc. is headquartered in New Albany, IN. Samtec USA services North America, part of the Continental Europe, Israel and Japan. Samtec has nine other worldwide locations servicing the UK, Germany, France, Italy, Singapore, Japan, Taiwan, China and Hong Kong. For information on a specific Samtec facility, please see our Worldwide Locations.

Samtec has available an E-Help Desk to handle any internet related questions or problems. For inquiries, contact our HelpDesk. For a list of other Samtec Associates, please visit our Associate Roster.

View our employment opportunities in our Jobs Section. You can also either fax your resume at 812/948-5047 or e-mail it to eHuman Resources.

Modifications to standard Samtec connectors are easily done in our Design Tool Area. You can create your own modified connector using our unique Redlining capabilities or use our new Build a Part Number program for very simple modifications. You can then check the status of your Application Specific Product and correspond with an Applications Engineer all in this one unique program. To register, go to our Create an ASP Registration Page.

Product prints and footprints are available in a PDF format on our Prints Page. You can view them on-line with Acrobat Reader or download for future use.

Catalog pages are available in a PDF format on our Catalog Page. You can view Catalog pages on-line with Acrobat Reader or download for future use.

Samtec has 11 different ways available to search for a Samtec part in our Product Search area. If you know a specific Samtec part, use our Search by Part Number. Know just the Samtec product series, but not the complete part number? Use our Search by Series Name. If you know what the product you need looks like but not the name, use our Search by Product Picture. Know only a description of the connector you are looking for? Use our Search by Product Description. You can also Search by Samtec Brand Name, Competitor Brand Name, Industry Standard, Industry, Board Stacking Height or by Competitor Part Number.

If you are looking specifically for High Speed, Signal Integrity Products, Samtec has 6 different search functions: Frequency, Rise Time, Data Rate, Series, Description, Board Stacking.

Samtec products undergo extensive qualification testing by independent laboratories to ensure the highest quality interconnect products. They are also subject to general specifications and standard test procedures. To view either the list of reports or the general specifications that apply to Samtec products, go to our Standard Products: Quality Information area. The Test Reports are available in a PDF format for viewing on-line with Acrobat Reader. You can also view on-line Samtecs UL, CSA or ISO certifications.

Samtec's Signal Integrity products adhere to our own High Speed Characterization Test procedures. For more information on what is included on these test procedures, Click here.

Custom connectors are easily done in our Design Tools Area. You can create your own custom connector using our Redlining capabilities. You can then check the status of your Application Specific Product and correspond with an Applications Engineer all in this one unique program. To register, go to our create an ASP Registration Page..

Samtec Inc
3837 Reliable Parkway
Chicago, IL 60686-0038

What are Samtec’s terms?

Net 30 with a FOB of New Albany, IN

Standard Pricing is available on our web site. Customer Specific Pricing Information is available with Samtecs Service Center. A Service Center features your specific Pricing, Delivery, Order Status, Quote Inquiry, Expediting and On-Line Order Entry. Your Personal Service Center also features up-to-date information on New Products, Products in Design, Process Improvements for possible lower-cost alternative solutions and New Services and Capabilities. To apply for a Service Center, send your complete company information including phone and fax to Service Center. To request pricing on specific Samtec Part Numbers via email, contact our Pricing Group.

Use our Buy Now to quickly and easily place an order with Samtec. Customer Specific Order Entry is available with Samtecs Service Center. A Service Center features On-Line Order Entry, your specific Pricing, Delivery, Order Status, Quote Inquiry and Expediting. Your Service Center also features up-to-date information on New Products, Products in Design, Process Improvements for possible lower-cost alternative solutions and New Services and Capabilities. To apply for a Service Center, send your complete company information including phone and fax to Service Center..

Samtec uses GE Information Services (GEIS) to conduct business transactions via standard EDI document transmission. We trade both ANSI ASC X12 and EDIFACT standards. Current documents traded in the ANSI ASC X12 standard are: 810, 824, 830, 846, 850, 855, 856, 860, 865, 870, and 997. The current EDIFACT documents traded are INVOIC, DELFOR, ORDERS, ORDRSP, ORDCHG, and CONTRL.

If you are interested in conducting EDI transactions with Samtec, please contact Daniel Williams with the documents you require via EDI and the monthly volume of these documents.

Does Samtec have an on-line credit application form?

Please click here to download our Application for Credit form. Please complete and return this form to us either via fax (812-981-4310) or e-mail our Accounting Dept.

Does Samtec accept credit cards, and is there an online Credit-Card Authorization form?

Yes, Samtec accepts Visa, Mastercard, and American Express. This form is to be used for Web orders only and MUST BE COMPLETED WITH EACH ORDER SUBMITTED. Samtec does not hold your credit card information for future orders. It is the customers responsibility to provide credit card information at the time of order entry. Click here to download our Credit Card Authorization Form, and return this form to us either via fax (812-981-4310) or e-mail (Accounting Dept.)

55322

3670

What is Samtec’s Tax ID number?

35-1399589

Samtecs UL number is E111594-N.

To view Samtecs UL, CSA or ISO certifications, click the corresponding link. .

For UL questions, please contact our UL group.

Samtec products undergo extensive qualification testing by independent laboratories to ensure the highest quality interconnect products. They are also subject to general specifications and standard test procedures. To view either the list of reports or the general specifications that apply to Samtec products, go to our Standard Products: Quality Information area. The Test Reports are available in a PDF format for viewing on-line with Acrobat Reader. You can also view on-line Samtecs UL, CSA or ISO certifications.

Samtec's Signal Integrity Products adhere to our own High Speed Characterization Test procedures. For more information on what's included in these test procedures, Click Here.

Yes, Samtec is QS9000 approved at its corporate headquarters in New Albany. Samtec UK in Scotland and Samtec AP in Singapore are both ISO9002 approved. To view our QS9000 certification, see our QS9000 Page.

Do you have a policy statement on the lead-free environmental issue? Is this available on-line?

Yes and Yes.

Samtec's Environmental Policy

Do you have a roadmap for your planned lead-free production? Is this available on-line?

Yes and Yes.
Samtec's Lead Free Production Roadmap

IDSD/IDMD/HCXX cable assemblies - not compliant - expected to be compliant by late November 2005. The connector ends (plastic, pins and plating) are compliant.

HDR products with leaded solder not compliant - can be ordered special as lead-free and RoHS compliant

Any solder ball product is not compliant if the solder balls are included in the part call-out (no current alternate lead-free, RoHS compliant solder ball)

I-O products are not compliant (a few exceptions)....must check each part number to see if we have material information or declaration

Standard "CLX" series parts that use pre-plated pins are not compliant (must check part number to confirm status)

Any product containing wire, cable, hardware such as screws, nuts, bolts, metal shields is suspect and should be verified.

Will there be an increase in lead times for lead-free products?

No

Will there be an increase in the price of lead-free products?

No

Are there any plans to obsolete any parts due to lead-free?

No

Are you conducting any Tin Whisker testing?

We are currently conducting tin whisker testing; results should be available January 2006 time frame.

Are material declarations available for your lead-free products? How do I get to them?

Yes. Currently, material declarations for the majority of Samtec products are available on our website. This accounts for 80% of the top selling product series.

Lead Free Product Materials Declaration

The primary differences are:

Temperature compatibility - Matte Tin is compatible with the elevated temperatures of lead-free, reflow processing (250-260C). Bright Tin has a tendency to discolor (turn dark) when exposed to the higher lead-free, reflow processing environment.

Grain size - Matte Tin has a larger grain size than Bright Tin.

Appearance - Matte Tin has a normal whitish "matte" surface appearance whereas Bright Tin has a bright (shiny) surface finish.

I am transitioning to lead-free processing. Why should I choose Matte Tin?

Matte Tin is readily available and has a successful track record of reliability.

Matte Tin is compatible with all existing lead-alloy and Pb-free solders and pastes.

Matte Tin tolerates the higher process temperatures required for lead-free processing.

The larger grain size of Matte Tin (as compared to Bright Tin) creates less stress in the plating. Stress in pure Tin plating may be a root cause of tin whisker formation and growth.

What is the composition of Matte Tin and Bright Tin?

The Matte Tin and Bright Tin platings applied by Samtec are essentially 100% pure Tin. The Matte Tin applied by Samtec contains approximately 0.015% co-deposited organics as opposed to Bright Tin with approximately 0.15% co-deposited organics.

Are Matte Tin and Bright Tin compliant with the European Union RoHS Directive?

The Matte Tin and Bright Tin platings applied by Samtec are compliant with the RoHS Directive (Directive 2002/95/EC).

Is Matte Tin compatible with leaded solder processes?

Matte Tin is backward compatible with leaded solder processing.

Will Matte Tin prevent Tin Whiskers from forming?

No high-Tin plating process can claim to be whisker-free. Copper/copper-alloy lead frames plated on a Nickel diffusion barrier are highly whisker resistant.

Does Samtec use a barrier plating or underplating with Matte Tin?

All finish platings applied by Samtec are preceded by a Nickel diffusion barrier. Generally speaking, the thickness of the Nickel barrier underplating is 50 micro-inch minimum.

What is the thickness of the Matte Tin plating applied by Samtec?

The thickness of the Matte Tin plating is part specific. The majority of products will have a minimum 150 micro-inch to 350 micro-inch plating thickness.

Is there a price penalty for Matte Tin?

Presently, Samtec does not anticipate a price difference between Bright Tin and Matte Tin.

Will specifying Matte Tin impact my lead times?

The lead times for the majority of Samtec products will not be affected by specifying Matte Tin plating.

Do I need to change my part numbers to specify Matte Tin?

Until Samtec transitions to Matte Tin as "standard tin plating", one will need to specify Matte Tin plating by adding the Alpha character "M" immediately following the plating designator in the Samtec part call-out (note - does not apply to Tin-lead plating).

Beginning March 1, 2006, Matte Tin will become the Samtec "standard Tin plating". There will be no need to specify Matte Tin by a part number change after this date.

Can I continue to order product with Bright Tin plating?

It is the intent of Samtec to continue to support customers requesting Bright Tin plating. Bright Tin will remain Samtec's "standard tin plating" until March 1, 2006. After that date, if you prefer to specify Bright Tin plating, contact Samtec Customer Service at info@samtec.com for instructions.

Can I continue to order product with Tin-lead plating?

Consistent with our past history, it is the intent of Samtec to continue to support customers requesting Tin-lead plating. The Tin-lead plating designators "-TL" (Tin-lead) and "-STL" (Selective Tin-lead) will remain valid plating designators for part call-outs.

Will I receive a mixed shipment containing some Matte Tin plated parts and some Bright Tin plated parts?

No. Product will be shipped bearing the plating specified by the part call-outs in the customer order.